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Machine translation
1. (WO2005062374) DICING/DIE BONDING FILM AND METHOD OF MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/062374    International Application No.:    PCT/JP2004/018531
Publication Date: 07.07.2005 International Filing Date: 07.12.2004
IPC:
H01L 21/00 (2006.01), H01L 21/58 (2006.01), H01L 21/68 (2006.01)
Applicants: DOW CORNING TORAY CO., LTD. [JP/JP]; 1-3, Marunouchi 1-chome, Chiyoda-ku, Tokyo, 1000005 (JP) (For All Designated States Except US).
SUTOH, Manabu [JP/JP]; (JP) (For US Only).
USHIO, Yoshito [JP/JP]; (JP) (For US Only)
Inventors: SUTOH, Manabu; (JP).
USHIO, Yoshito; (JP)
Priority Data:
2003-426021 24.12.2003 JP
Title (EN) DICING/DIE BONDING FILM AND METHOD OF MANUFACTURING THE SAME
(FR) FEUILLE DE DECOUPAGE EN PUCES/FIXATION DE PUCES ET PROCEDE DE FABRICATION
Abstract: front page image
(EN)A dicing/die bonding sheet is made by joining a base film (1) and a silicone based adhesive agent layer (3) through the medium of an undercoat layer (2). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing.
(FR)L'invention concerne une feuille de découpage en puces/fixation de puces par assemblage d'un film de base (1) et d'une couche d'agent adhésif à base de silicone (3) via une couche intermédiaire (2). Cette feuille de découpage en puces/fixation de puces tout-en-un présente une stabilité de stockage supérieure à long terme et empêche le délaminage des puces au cours du découpage en puces.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)