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1. WO2005062127 - METHOD FOR JOINING AT LEAST TWO MEMBERS

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Publication Number WO/2005/062127
Publication Date 07.07.2005
International Application No. PCT/NL2004/000898
International Filing Date 22.12.2004
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G03F 7/707
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
707Chucks, e.g. chucking or un-chucking operations
G03F 7/70808
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
G03F 7/70825
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
70825Mounting of individual elements, e.g. mounts, holders or supports
G03F 7/7095
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
7095Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
Applicants
  • ASML NETHERLANDS B.V. [NL]/[NL] (AllExceptUS)
  • VAN ELP, Jan [NL]/[NL] (UsOnly)
Inventors
  • VAN ELP, Jan
Agents
  • WINCKELS, J.H.F.
Priority Data
10/740,83122.12.2003US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR JOINING AT LEAST TWO MEMBERS
(FR) PROCEDE D'ASSEMBLAGE D'AU MOINS UN PREMIER ELEMENT ET D'UN SECOND ELEMENT, MACHINE LITHOGRAPHIQUE ET PROCEDE DE FABRICATION DE DISPOSITIF, ET DISPOSITIF AINSI OBTENU
front page image
Abstract
(EN)
A method for joining at least two members of a lithographic apparatus is disclosed. The method includes providing a first member (1), providing a second member (2), direct-bonding the first member and the second member to form a direct-bond, and anodically bonding the first member and the second member. At least one of the members includes ultra low expansion glass and/or ultra low expansion glass ceramics.
(FR)
L'invention concerne un procédé d'assemblage d'au moins deux éléments lithographiques. Ce procédé consiste à: fournir d'abord un premier élément, fournir ensuite un second élément, soumettre le premier élément et le second élément à une opération de liaison directe pour former une liaison directe, et enfin, soumettre le premier élément et le second élément à une liaison anodique. Au moins un de ces éléments contient du verre à très faible coefficient de dilatation et/ou des vitrocéramiques à très faible coefficient de dilatation.
Also published as
DE602004007409
EP1697800
JP2007523030
US20050132750
Latest bibliographic data on file with the International Bureau
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