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1. WO2005061586 - POLYAMIDE ACID RESIN HAVING UNSATURATED GROUP, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, AND CURED PRODUCT THEREOF

Publication Number WO/2005/061586
Publication Date 07.07.2005
International Application No. PCT/JP2004/019009
International Filing Date 20.12.2004
Chapter 2 Demand Filed 17.08.2005
IPC
C08G 73/16 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
16Polyester-imides
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
CPC
C08G 73/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
16Polyester-imides
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
H05K 1/0346
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
032consisting of one material
0346containing N
H05K 3/3452
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
3452Solder masks
Applicants
  • 日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • 網島 千華 AMISHIMA, Chika [JP]/[JP] (UsOnly)
  • 田中 竜太朗 TANAKA, Ryutaro [JP]/[JP] (UsOnly)
  • 亀谷 英照 KAMETANI, Hideaki [JP]/[JP] (UsOnly)
  • 小柳 敬夫 KOYANAGI, Hiroo [JP]/[JP] (UsOnly)
Inventors
  • 網島 千華 AMISHIMA, Chika
  • 田中 竜太朗 TANAKA, Ryutaro
  • 亀谷 英照 KAMETANI, Hideaki
  • 小柳 敬夫 KOYANAGI, Hiroo
Agents
  • 佐伯 憲生 SAEKI, Norio
Priority Data
2003-42495022.12.2003JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYAMIDE ACID RESIN HAVING UNSATURATED GROUP, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, AND CURED PRODUCT THEREOF
(FR) RESINE D'ACIDE POLYAMIDE CONTENANT UN GROUPE INSATURE, COMPOSITION DE RESINE PHOTOSENSIBLE L'UTILISANT ET PRODUIT DURCI OBTENU AVEC CES RESINES
(JA) 不飽和基含有ポリアミド酸樹脂及びそれを用いた感光性樹脂組成物並びにその硬化物
Abstract
(EN)
Disclosed is a novel polyamide acid resin (A) containing an unsaturated group which is suitable for a photosensitive resin composition. Also disclosed is a photosensitive resin composition using such a polyamide acid resin which is excellent in photosensitivity. A cured product of such a photosensitive resin composition is excellent in flexibility as well as in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. The polyamide acid resin (A) containing an unsaturated group is obtained by reacting a polyester resin (a) containing an unsaturated group wherein an anhydride group is at the end and a compound (b) having two amino groups in a molecule. The photosensitive resin composition contains such a polyamide acid resin (A) containing an unsaturated group, a crosslinking agent (B) and a photopolymerization initiator (C).
(FR)
L'invention concerne une nouvelle résine d'acide polyamide (A) contenant un groupe insaturé conçu pour s'utiliser dans une composition de résine photosensible. L'invention concerne aussi une composition de résine photosensible utilisant cette résine d'acide polyamide, qui possède une excellente photosensibilité. Un produit durci, obtenu à partir de cette résine photosensible, possède une excellente flexibilité ainsi qu'une bonne force d'adhérence, une bonne résistance aux crayons, aux solvants, aux acides, aux températures élevées, au plaquage à l'or ou similaire. La résine d'acide polyamide (A) contenant un groupe insaturé est obtenue par la réaction d'une résine de polyester (a) contenant un groupe insaturé, dans lequel un groupe d'anhydride se situe à l'extrémité, et un composé (b) contenant deux groupes aminés dans une molécule. La composition de résine photosensible contient un acide polyamide (A) contenant un groupe insaturé, un agent de réticulation (B) et un initiateur de photopolymérisation (C).
(JA)
 本発明は感光性樹脂組成物に適する新規な不飽和基含有ポリアミド酸樹脂(A)及びそれを用いた、光感度に優れ、得られた硬化物は、フレキシブル性に優れると共に密着性、鉛筆硬度、耐溶剤性、耐酸性、耐熱性、耐金メッキ性等にも優れた感光性樹脂組成物を提供する。該不飽和基含有ポリアミド酸樹脂(A)は、末端が無水物基である不飽和基含有ポリエステル樹脂(a)と分子中に2個のアミノ基を有する化合物(b)とを反応させることにより得られ、該感光性樹脂組成物は該不飽和基含有ポリアミド酸樹脂(A)、架橋剤(B)及び光重合開始剤(C)を含有する脂組成物とすることにより得られる。
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