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Machine translation
1. (WO2005061178) CHEMICAL MECHANICAL POLISHING METHOD FOR REDUCING SLURRY REFLUX
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/061178    International Application No.:    PCT/US2004/040219
Publication Date: 07.07.2005 International Filing Date: 02.12.2004
Chapter 2 Demand Filed:    28.06.2005    
IPC:
B24B 37/04 (2012.01), B24B 49/04 (2006.01), B24B 7/22 (2006.01), H01L 21/306 (2006.01)
Applicants: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. [US/US]; 1105 North Market Street, Suite 1300, Wilmington, DE 19899 (US)
Inventors: CRKVENAC, T., Todd; (US).
HENDRON, Jeffrey, J.; (US).
MULDOWNEY, Gregory, P.; (US)
Agent: BIEDERMAN, Blake, T.; Rohm and Haas Electronic Materials CMP Holdings, Inc., 1105 North Market Street, Suite 1300, Wilmington, DE 19899 (US)
Priority Data:
10/734,945 11.12.2003 US
Title (EN) CHEMICAL MECHANICAL POLISHING METHOD FOR REDUCING SLURRY REFLUX
(FR) PROCEDE DE POLISSAGE MECANICO-CHIMIQUE POUR LIMITER LE REFLUX DE SUSPENSION
Abstract: front page image
(EN)A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium such as a slurry (116). The method includes selecting the rotational rate of the article or the velocity of the polishing layer, or both, so as to control either removal rate uniformity or the occurrence of defects on the polished surface, or both.
(FR)La présente invention concerne un procédé pour polir la surface (120) d'un article, par ex. d'une tranche de semi-conducteur (112, 212), au moyen d'une couche de polissage (108, 208), en la présence d'une substance de polissage telle qu'une suspension (116). Le procédé comprend la sélection de la vitesse de rotation de l'article et/ou de la vitesse de déplacement de la couche de polissage, de façon à réguler l'uniformité de taux d'élimination et/ou l'occurrence des défauts sur la surface polie.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)