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Machine translation
1. (WO2005061177) PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/061177    International Application No.:    PCT/US2004/037870
Publication Date: 07.07.2005 International Filing Date: 12.11.2004
IPC:
B23H 5/06 (2006.01), B23H 5/08 (2006.01), B23H 5/10 (2006.01), B24B 37/04 (2012.01), B24B 49/16 (2006.01), B24B 53/007 (2006.01), B24D 13/14 (2006.01), H01L 21/321 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Ave, Santa Clara, CA 95054 (US) (For All Designated States Except US).
HU, Yongqi [CN/US]; (US) (For US Only).
TSAI, Stan D. [CA/US]; (US) (For US Only).
WANG, Yan [CN/US]; (US) (For US Only).
LIU, Feng Q. [CN/US]; (US) (For US Only).
CHANG, Shou-Sung [--/US]; (US) (For US Only).
CHEN, Liang-Yuh [--/US]; (US) (For US Only)
Inventors: HU, Yongqi; (US).
TSAI, Stan D.; (US).
WANG, Yan; (US).
LIU, Feng Q.; (US).
CHANG, Shou-Sung; (US).
CHEN, Liang-Yuh; (US)
Agent: PATTERSON, B. Todd; MOSER, PATTERSON & SHERIDAN, LLP, 3040 Post Oak Blvd., Suite 1500, Houston, TX 77056-6582 (US)
Priority Data:
10/727,724 03.12.2003 US
Title (EN) PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
(FR) ENSEMBLE TAMPON POUR TRAITEMENT ELECTROCHIMIQUE MECANIQUE
Abstract: front page image
(EN)Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
(FR)Sous différentes variantes, l'invention concerne un ensemble tampon pour le traitement d'un substrat, qui comprend une couche supérieure à surface de traitement et une électrode dont le haut est couplé à la couche supérieure, et un bas opposé au haut. On établit une première série de trous à travers la couche supérieure pour exposer l'électrode à la surface de traitement. Il existe au moins une ouverture à travers ladite couche et l'électrode.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)