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Machine translation
1. (WO2005060401) DIRECT CONTACT POWER TRANSFER PAD AND METHOD OF MAKING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/060401    International Application No.:    PCT/US2004/030857
Publication Date: 07.07.2005 International Filing Date: 20.09.2004
IPC:
H01R 12/04 (2006.01), H05K 1/11 (2006.01)
Applicants: MEDCONX, INC. [US/US]; 670 National Avenue, Mountain View, CA 94043 (US) (For All Designated States Except US).
KENT, Harold, B. [US/US]; (US) (For US Only).
LEVANTE, James, J. [US/US]; (US) (For US Only)
Inventors: KENT, Harold, B.; (US).
LEVANTE, James, J.; (US)
Agent: PETERSON, James, W.; Jones Day, 2882 Sand Hill Road, Suite 240, Menlo Park, CA 94025 (US)
Priority Data:
60/504,055 19.09.2003 US
Title (EN) DIRECT CONTACT POWER TRANSFER PAD AND METHOD OF MAKING SAME
(FR) PLOT DE TRANSFERT D'ENERGIE A CONTACT DIRECT ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN)A power transfer pad, having; an non-conductive (30) board having a top and a bottom plurality conductive substrates sections (32) disposed across the top of the non-conductive board (30); at least one conducting element disposed on each of the conductive substrate sections (32); a plurality of electrical contacts on the bottom the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board (30) are in electrical communication with one of the conductive substrate sections (32) on the top of non-conductive board (30).
(FR)La présente invention a trait à un plot de transfert d'énergie comportant : une carte non conductrice ayant une face supérieure et une face inférieure ; une pluralité de sections de substrat conductrices disposées à travers la face supérieure de la carte non conductrice ; au moins un élément conducteur disposé sur chacune des sections de substrat conductrices ; une pluralité de contacts électriques sur la face inférieure de la carte non conductrice, chacun des contacts électriques sur la face inférieure de la carte non conductrice étant en liaison électrique avec une des sections de substrat conductrices sur la face supérieure de la carte non conductrice.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)