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1. (WO2005038524) NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/038524    International Application No.:    PCT/US2004/033861
Publication Date: 28.04.2005 International Filing Date: 15.10.2004
Chapter 2 Demand Filed:    04.08.2005    
IPC:
G03C 5/18 (2006.01)
Applicants: ARCH SPECIALTY CHEMICALS, INC. [US/US]; 501 Merrit 7, P.O. Box 5204, Norwalk, CT 06856 (US)
Inventors: NAIINI, Ahmad, A.; (US).
HOPLA, Richard; (US).
POWELL, David, B.; (US).
METIVIER, Jon; (US).
RUSHKIN, Il'ya; (US)
Agent: GREELEY, Paul, D.; Ohlandt, Greeley, Ruggiero & Perle LLP, One Landmark Square, 10th Floor, Stamford, CT 06901-2682 (US)
Priority Data:
60/511,198 15.10.2003 US
  15.10.2004 US (Priority Withdrawn 03.01.2005)
Title (EN) NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
(FR) NOUVELLES COMPOSITIONS DE RESINE PHOTOSENSIBLE
Abstract: front page image
(EN)A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound containing from 2 to about 9 aromatic hydroxyl groups with a 5-naphthoquinone diazide sulfonyl compound and a 4-naphthoquinone diazide sulfonyl compound, and at least one solvent, and the use of such compositions to form a relief pattern on a substrate thereby forming a coated substrate.
(FR)Une composition photosensible positive comprend au moins un polymère précurseur polybenzoazole, un composé photoactif de diazonaphtoquinone qui est le produit de condensation d'un composé contenant entre 2 et environ 9 groupes hydroxyle aromatique et d'un composé sulfonyle diazide 5-naphtoquinone et d'un composé sulfonyle diazide 4-naphtoquinone diazide, et au moins un solvant. Cette invention se rapporte également à l'utilisation des compositions selon l'invention en vue de former un motif en relief sur un substrat et de former ainsi un substrat revêtu.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)