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Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2005/038391 International Application No.: PCT/JP2004/015753
Publication Date: 28.04.2005 International Filing Date: 18.10.2004
IPC:
G01B 7/06 (2006.01) ,H01L 21/304 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
7
Measuring arrangements characterised by the use of electric or magnetic means
02
for measuring length, width, or thickness
06
for measuring thickness
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants: TADA, Mitsuo[JP/JP]; JP (UsOnly)
SUTO, Yasunari[JP/JP]; JP (UsOnly)
EBARA CORPORATION[JP/JP]; 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510, JP (AllExceptUS)
Inventors: TADA, Mitsuo; JP
SUTO, Yasunari; JP
Agent: WATANABE, Isamu ; GOWA Nishi-Shinjuku 4F 5-8, Nishi-Shinjuku 7-chome Shinjuku-ku, Tokyo 160-0023, JP
Priority Data:
2003-35993820.10.2003JP
Title (EN) EDDY CURRENT SENSOR
(FR) DETECTEUR DE COURANT DE FOUCAULT
Abstract:
(EN) An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
(FR) L'invention concerne un détecteur de courant de Foucault (10) qui comporte un enroulement de détection (100) près d'un film conducteur (6) formé sur une plaquette à semi-conducteur (W) et une source de signaux (124) alimentant l'enroulement (100) en courant alternatif pour produire un courant de Foucault dans le film conducteur (6). Le détecteur (10) comporte un circuit de détection détectant le courant produit dans le film conducteur (6). Ce circuit est relié à l'enroulement (100). Le détecteur (10) comprend aussi une enceinte (200) en matériau ayant une perméabilité magnétique élevée. L'enceinte (200) reçoit l'enroulement (100) et a une conception permettant à cet enroulement (100) de former un trajet de flux magnétique (MF) qui assure la production efficace de courant de Foucault dans le film conducteur (6).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)