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Machine translation
1. (WO2005037488) POLISHING APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2005/037488 International Application No.: PCT/JP2004/015566
Publication Date: 28.04.2005 International Filing Date: 14.10.2004
IPC:
B24B 37/04 (2012.01) ,H01L 21/304 (2006.01) ,H01L 21/683 (2006.01)
Applicants: TORII, Hiroomi[JP/JP]; JP (UsOnly)
HAYAMA, Takuji[JP/JP]; JP (UsOnly)
YASHIMA, Tetsuya[JP/JP]; JP (UsOnly)
EBARA CORPORATION[JP/JP]; 11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510, JP (AllExceptUS)
Inventors: TORII, Hiroomi; JP
HAYAMA, Takuji; JP
YASHIMA, Tetsuya; JP
Agent: WATANABE, Isamu ; GOWA Nishi-Shinjuku 4F 5-8, Nishi-Shinjuku 7-chome Shinjuku-ku, Tokyo 160-0023, JP
Priority Data:
2003-35859317.10.2003JP
Title (EN) POLISHING APPARATUS
(FR) APPAREIL DE POLISSAGE
Abstract: front page image
(EN) A polishing apparatus has a top ring (1) configured to hold a semiconductor wafer (W) on a substrate holding surface and a pushser (130) configured to deliver the semiconductor wafer (W) to the top ring (1) and receive the semiconductor wafer (W) from the top ring (1). The pushser (130) includes a push stage (133) having a substrate placement surface on which the semiconductor wafer (W) is placed and an air cylinder (135) configured to vertically move the push stage (133). The pushser (130) also includes a high-pressure fluid port (220) configured to eject a high-pressure fluid toward the semiconductor wafer (W).
(FR) L'invention concerne un appareil de polissage comprenant un anneau supérieur (1) conçu pour supporter une plaquette semi-conductrice (W) sur une surface supportant un substrat et un poussoir (130) conçu pour placer la plaquette semi-conductrice (W) sur l'anneau supérieur (1) et pour recevoir celle-ci (W) dudit anneau (1). Le poussoir (130) comprend un étage de poussée (133) présentant une surface de placement de substrat sur laquelle la plaquette semi-conductrice (W) est placée et un cylindre pneumatique (135) conçu pour déplacer de manière verticale l'étage de poussée (133). Le poussoir (130) comprend également un orifice de fluide haute pression (220) conçu pour éjecter un fluide haute pression en direction de la plaquette semi-conductrice (W).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)