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Machine translation
1. (WO2005036617) WORK SINGLE WAFER PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/036617    International Application No.:    PCT/JP2003/013131
Publication Date: 21.04.2005 International Filing Date: 14.10.2003
IPC:
H01L 21/00 (2006.01), H01L 21/677 (2006.01), H01L 21/687 (2006.01)
Applicants: FUJI RESEARCH INSTITUTE CORPORATION [JP/JP]; 2-3, Kanda Nishikicho, Chiyoda-ku, Tokyo 101-8443 (JP) (For All Designated States Except US).
HAYASHI, Takehide [JP/JP]; (JP) (For All Designated States Except US).
NAKAZAWA, Seiichi [JP/JP]; (JP) (For US Only)
Inventors: NAKAZAWA, Seiichi; (JP)
Agent: SHIMADA, Yoshikatsu; Room 1011, Hosokawa Bldg., 1-17, Akasaka 1-chome, Minato-ku, Tokyo 107-0052 (JP)
Priority Data:
Title (EN) WORK SINGLE WAFER PROCESSING SYSTEM
(FR) SYSTEME DE TRAITEMENT DE PLAQUETTE UNIQUE
(JA) ワーク枚葉処理システム
Abstract: front page image
(EN)A work single wafer processing system comprising a station (4) for feeding a single wafer into a BAY or repacking it to an FOUP, an EFEM (6) fixed to a semiconductor production system, a clean tunnel (7) sharing a clean region between the EFEM and the station, a single wafer conveyor (3) conveying a wafer in the clean tunnel, and a control system CS for controlling the single wafer conveyor (3), the station (4), the EFEM (6) and the production systems (50-54), in which alternative BAY processing, high efficiency wafer collection processing, imaginary load port processing and simultaneous wafer collection processing can be controlled in addition to normal processing and a concrete processing procedure is defined.
(FR)L'invention concerne un système de traitement de plaquette unique qui comprend une station (4) d'alimentation de plaquette unique sur baie (BAY) ou de reconditionnement sur unité FOUP, un module frontal d'équipement EFEM (6) fixé à un système de production de semiconducteur, un tunnel propre (7) partageant une région propre entre le module EFEM et la station, un système de transport de plaquette unique (3) vers le tunnel, et un système de contrôle CS contrôlant le système de transport (3), la station (4), le module EFEM (6) et les systèmes de production (50-54), permettant de contrôler le traitement sur baie (BAY) à l'alternat, le traitement de collecte de plaquette haute efficacité, le traitement de point d'accès de charge imaginaire, et le traitement de collecte de plaquette simultané, outre le traitement normal. On définit enfin une procédure de traitement concrète.
(JA)not available
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)