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1. (WO2005034589) HOUSING FOR ELECTRONIC BALLAST
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2005/034589 International Application No.: PCT/US2004/032528
Publication Date: 14.04.2005 International Filing Date: 04.10.2004
IPC:
B32B 15/08 (2006.01) ,H05K 5/02 (2006.01) ,H05K 9/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
SANROMA, John P. [US/US]; US (UsOnly)
HOLDEN, Russell R. [US/US]; US (UsOnly)
JOHNSON, Andrew O. [US/US]; US (UsOnly)
BOUCHARD, Guy P. [US/US]; US (UsOnly)
OSRAM SYLVANIA INC. [US/US]; 100 Endicot Street Danvers, MA 01923, US (AllExceptUS)
Inventors:
SANROMA, John P.; US
HOLDEN, Russell R.; US
JOHNSON, Andrew O.; US
BOUCHARD, Guy P.; US
Agent:
CASTEL, Benoit; c/o Young & Thompson 745 South 23rd Street, Suite 200 Arlington, VA 22202, US
Priority Data:
60/508,52003.10.2003US
Title (EN) HOUSING FOR ELECTRONIC BALLAST
(FR) COMPARTIMENT POUR BALLAST ELECTRONIQUE
Abstract:
(EN) An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).
(FR) L'invention concerne un assemblage de compartiment électronique constitué d'un joint d'étanchéité écologique, d'une commande EMI et d'un bon couplage thermique entre des composants électriques chauds contenus à l'intérieur de l'assemblage et un puits de chaleur extérieur.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)