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1. (WO2005034200) ADJUSTABLE SELF-ALIGNED AIR GAP DIELECTRIC FOR LOW CAPACITANCE WIRING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/034200    International Application No.:    PCT/US2004/032404
Publication Date: 14.04.2005 International Filing Date: 30.09.2004
IPC:
H01L 23/522 (2006.01), H01L 23/532 (2006.01)
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road, Armonk, NY 10504 (US) (For All Designated States Except US).
GEFFKEN, Robert, M. [US/US]; (US) (For US Only).
MOTSIFF, William, T. [US/US]; (US) (For US Only)
Inventors: GEFFKEN, Robert, M.; (US).
MOTSIFF, William, T.; (US)
Agent: CANALE, Anthony, J.; International Business Machines Corporation, Intellectual Property Law - Zip 972E, 1000 River Street, Essex Junction, VT 05452 (US)
Priority Data:
10/605,440 30.09.2003 US
Title (EN) ADJUSTABLE SELF-ALIGNED AIR GAP DIELECTRIC FOR LOW CAPACITANCE WIRING
(FR) DIELECTRIQUE REGLABLE A ENTREFER AUTO-ALIGNE POUR CABLAGE DE FAIBLE CAPACITE
Abstract: front page image
(EN)An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect (64a) adjacent a second interconnect (64b) on an interconnect level, spacers (60b, 60c) formed along adjacent sides of the first and second interconnects, and an air gap (68) formed between the first and second interconnects. The air gap extends above an upper surface (74a, 74b) of at least one of the first and second interconnects and below a lower surface (76a, 76b) of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
(FR)Cette invention concerne une structure réglable à entrefer auto-aligné pour circuit intégré de faible capacité, comprenant un première interconnexion (64a) disposée contre une seconde interconnexion (64b) sur un plan d'interconnexion, des entretoises (60b, 60c) formées contre les côtés adjacents des première et seconde interconnexions, et un entrefer formé entre les première et seconde interconnexions. L'entrefer dépasse au-dessus d'une surface supérieure (74a, 74b) d'au moins l'une des première et seconde interconnexions et au-dessous d'une surface inférieure (76a, 76b) d'au moins l'une des première et seconde interconnexions. La distance entre les entretoises définit la largeur de l'entrefer. L'entrefer est auto-aligné par rapport aux côtés adjacents des première et seconde interconnexions.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)