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Machine translation
1. (WO2005032764) SYSTEM, METHOD AND APPARATUS FOR APPLYING LIQUID TO A CMP POLISHING PAD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/032764    International Application No.:    PCT/US2004/029010
Publication Date: 14.04.2005 International Filing Date: 02.09.2004
IPC:
B24B 37/04 (2012.01), B24B 57/02 (2006.01)
Applicants: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, CA 94538 (US) (For All Designated States Except US).
PHAM, Xuyen [US/US]; (US) (For US Only).
ZHOU, Ren [US/US]; (US) (For US Only).
TU, Wen-Chiang [--/US]; (US) (For US Only)
Inventors: PHAM, Xuyen; (US).
ZHOU, Ren; (US).
TU, Wen-Chiang; (US)
Agent: LEAVELL, George, B.; Martine & Penilla, LLP, 710 Lakeway Drive, Suite 170, Sunnyvale, CA 94085 (US)
Priority Data:
10/676,388 30.09.2003 US
Title (EN) SYSTEM, METHOD AND APPARATUS FOR APPLYING LIQUID TO A CMP POLISHING PAD
(FR) SYSTEME, PROCEDE ET APPAREIL POUR L'APPLICATION DE LIQUIDE A UN TAMPON A POLIR DE PLANARISATION MECANO-CHIMIQUE
Abstract: front page image
(EN)A system and method of delivering a liquid to a CMP polishing pad (14) includes supplying the liquid to a nozzle (208), the nozzle (208) being oriented toward a polishing surface of the CMP polishing pad (14). The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle (208). The liquid is substantially evenly sprayed from the nozzle (208) onto the CMP polishing pad (14).
(FR)La présente invention a trait à un système et un procédé pour l'application de liquide à un tampon à polir de planarisation mécano-chimique (14) comprenant l'alimentation du liquide à une buse (208), la buse (208) étant orientée vers la surface du tampon à polir de planarisation mécano-chimique (14). Le liquide s'écoule à un débit inférieur ou égal à environ 100 cc par minute. Un gaz vecteur sous pression est également alimenté à la buse (208). Le liquide est pulvérisé de manière sensiblement uniforme depuis la buse (208) sur le tampon à polir de planarisation mécano-chimique (14).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)