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1. (WO2005031805) MULTI-SURFACE IC PACKAGING STRUCTURES AND METHODS FOR THEIR MANUFACTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/031805    International Application No.:    PCT/US2004/031350
Publication Date: 07.04.2005 International Filing Date: 24.09.2004
IPC:
H01L 23/48 (2006.01), H01L 23/495 (2006.01)
Applicants: SILICON PIPE, INC. [US/US]; 1299 Parkmoor Avenue, San Jose, CA 95126 (US) (For All Designated States Except US).
FJELSTAD, Joseph, C. [US/US]; (US) (For US Only).
SEGARAM, Para, K. [US/US]; (US) (For US Only).
INESSA, Obenhuber [US/US]; (US) (For US Only).
GRUNDY, Kevin, P. [US/US]; (US) (For US Only)
Inventors: FJELSTAD, Joseph, C.; (US).
SEGARAM, Para, K.; (US).
GRUNDY, Kevin, P.; (US).
OBENHUBER, Thomas, J.;
Agent: SHEMWELL, Charles, E.; Shemwell Gregory & Courtney LLP, 4880 Stevens Creek Blvd., Suite 201, San Jose, CA 95129 (US)
Priority Data:
60/506,322 24.09.2003 US
10/947,686 23.09.2004 US
Title (EN) MULTI-SURFACE IC PACKAGING STRUCTURES AND METHODS FOR THEIR MANUFACTURE
(FR) STRUCTURES D'ENCAPSULATION DE CIRCUIT INTEGRE MULTISURFACE ET PROCEDES DE FABRICATION
Abstract: front page image
(EN)An IC package (400) having multiple surfaces for interconnection with interconnection elements (403) making connections from the IC chip to the I/O terminations (409) of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
(FR)L'invention concerne un boîtier de circuit intégré multisurface pour l'interconnexion avec des éléments d'interconnexion assurant les connexions depuis la puce de circuit intégré vers les bornes entrée/sortie de l'ensemble boîtier qui se trouvent sur plus d'une surface de ce boîtier et permettent les connexions avec d'autres dispositifs ou ensembles séparés de lui spatialement.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)