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1. WO2005029554 - MULTIDIRECTIONAL LIGHT EMITTING DIODE UNIT

Publication Number WO/2005/029554
Publication Date 31.03.2005
International Application No. PCT/US2004/030601
International Filing Date 17.09.2004
IPC
H01L 29/24 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
02Semiconductor bodies
12characterised by the materials of which they are formed
24including, apart from doping materials or other impurities, only inorganic semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20 or H01L29/22246
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2924/1815
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
181Encapsulation
1815Shape
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
Applicants
  • MATTEL, INC. [US]/[US]
Inventors
  • WONG, Yeung, Chung
Agents
  • JAMIESON, John
Priority Data
60/504,40819.09.2003US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MULTIDIRECTIONAL LIGHT EMITTING DIODE UNIT
(FR) UNITE DE DIODES ELECTROLUMINESCENTES MULTIDIRECTIONNELLES
Abstract
(EN) A multidirectional light emitting diode unit (10, 10', 10') includes a light emitting diode chip (20, 20', 20') configured to emit light from at least one side of the chip when powered. An at least translucent casing (12, 12', 12') extends from at least the one side of the light emitting diode chip. A distal end (121, 121', 121 ') of the casing has at least two protrusions (12a, 12b, 12a', 12b', 12c', 12a', 12b', 12c', 12d'). Each protrusion has a substantially flat distal end surface facing outwardly away from the light emitting diode chip and inwardly toward a centerline of a cylindrical sidewall (122, 122', 122') to form a recess between the protrusions within the distal end of the casing. Light from the light emitting diode chip is internally reflected by the sidewall and directed outwardly from the casing through the flat surfaces along output directions normal thereto.
(FR) La présente invention a trait à une unité de diodes électroluminescentes multidirectionnelles (10, 10', 10') comportant une puce de diodes électroluminescentes (20, 20', 20') agencées à émettre de la lumière à partir d'au moins une face de la puce lors de son alimentation. Au moins un boîtier translucide (12, 12', 12') s'étend depuis au moins ladite au moins une face de la puce de diodes électroluminescentes. Une extrémité distale (121, 121', 121 ') du boîtier présente au moins deux saillies (12a, 12b, 12a', 12b', 12c', 12a', 12b', 12c', 12d'). Chaque saillie comporte une surface d'extrémité distale sensiblement plane tournée vers l'extérieur en éloignement de la puce de diodes électroluminescentes et vers l'intérieur en direction d'un axe longitudinal d'une paroi latérale de forme cylindrique (122, 122', 122') pour former un évidement entre les saillies au sein de l'extrémité distale du boîtier. La lumière en provenance de la puce de diodes électroluminescentes est réfléchie de manière interne par la paroi latérale et orientée vers l'extérieur à partir du boîtier à travers les surfaces planes selon des directions de sortie normales à celles-ci.
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