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1. (WO2005029185) LED LIGHTING SOURCE AND LED LIGHTING APPARATUS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2005/029185 International Application No.: PCT/JP2004/013290
Publication Date: 31.03.2005 International Filing Date: 07.09.2004
IPC:
H01L 33/32 (2010.01) ,F21V 17/00 (2006.01) ,F21V 19/00 (2006.01) ,F21V 29/00 (2006.01) ,F21V 3/02 (2006.01) ,H01L 25/075 (2006.01) ,H01L 33/54 (2010.01) ,H01L 33/56 (2010.01) ,H01L 33/60 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/64 (2010.01) ,F21Y 101/02 (2006.01) ,F21Y 103/025 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
26
Materials of the light emitting region
30
containing only elements of group III and group V of the periodic system
32
containing nitrogen
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
17
Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19
Fastening of light sources or lamp holders
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29
Cooling or heating arrangements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
3
Globes; Bowls; Cover glasses
02
characterised by the shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
60
Reflective elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
02
Miniature, e.g. light emitting diodes (LED)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
103
Elongated light sources, e.g. fluorescent tubes
02
curved, e.g. ring-shaped
025
U-shaped
Applicants:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oazakadoma Kadoma-shi, Osaka 571-8501, JP (AllExceptUS)
NISHIMOTO, KEIJI; null (UsOnly)
TANIMOTO, Noriyasu; null (UsOnly)
SHIMIZU, Masanori; null (UsOnly)
NAGAI, Hideo; null (UsOnly)
SAITO, Takeshi; null (UsOnly)
Inventors:
NISHIMOTO, KEIJI; null
TANIMOTO, Noriyasu; null
SHIMIZU, Masanori; null
NAGAI, Hideo; null
SAITO, Takeshi; null
Agent:
NAKAJIMA, Shiro; 6F, Yodogawa 5-Bankan 2-1, Toyosaki 3-chome Kita-ku, Osaka-shi Osaka 531-0072, JP
Priority Data:
2003-32357516.09.2003JP
Title (EN) LED LIGHTING SOURCE AND LED LIGHTING APPARATUS
(FR) SOURCE ET APPAREIL D'ECLAIRAGE PAR DEL
Abstract:
(EN) An LED lighting source preventing heat deterioration and improving luminous efficiency includes a mounting substrate having a wiring pattern on a first main surface thereof and a plurality of LED bare chips, each composed of a first semiconductor layer and a second semiconductor layer having respectively different conductivity, an active layer disposed therebetween, and a metal electrode on the first semiconductor layer and substantially equal in area thereto, and each LED bare chip being joined to the wiring pattern according to flip chip mounting of the metal electrode to form a junction between the wiring pattern and the metal electrode. Each junction is formed so that an area thereof is at least 20% of the area of the metal electrode. Thermal resistance from the active layers through to a second main surface of the mounting substrate, which is a back surface thereof, is set to 3.0 9C/W or lower.
(FR) L'invention porte sur source d'éclairage par DEL, non détériorable par la chaleur et d'un rendement lumineux accru, comportant: un substrat support dont la surface principale comporte un réseau de conducteurs et plusieurs puces nues de DELs comprenant chacune une première couche semi-conductrice et une deuxième couche semi-conductrice de conductivité différente; une couche active située entre elles; et une électrode métallique placée sur la première couche semi-conductrice et d'une surface sensiblement égale. Chacune des puces nues de DEL est reliée au réseau de conducteurs suivant le montage retourné de l'électrode métallique pour former une jonction entre le réseau de conducteur et l'électrode métallique. Chacune des jonctions présente une surface d'au moins celle de l'électrode métallique. La résistance thermique des couches actives, jusqu'à la deuxième surface principale du substrat support qui en constitue la surface dorsale, est d'au plus 3,0 °C/W.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1665397JP2007528588US20070023769