H | ELECTRICITY |
01 | BASIC ELECTRIC ELEMENTS |
L | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR |
2224 | Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00 |
01 | Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto |
42 | Wire connectors; Manufacturing methods related thereto |
47 | Structure, shape, material or disposition of the wire connectors after the connecting process |
48 | of an individual wire connector |
481 | Disposition |
48151 | Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive |
48221 | the body and the item being stacked |
48225 | the item being non-metallic, e.g. insulating substrate with or without metallisation |
48227 | connecting the wire to a bond pad of the item |