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Pub. No.:    WO/2005/013656    International Application No.:    PCT/US2004/024557
Publication Date: 10.02.2005 International Filing Date: 29.07.2004
Chapter 2 Demand Filed:    20.05.2005    
H01R 13/24 (2006.01)
Applicants: TYCO ELECTRONICS CORPORATION [US/US]; 2901 Fulling Mill Road, Middletown, PA 17057 (US)
Inventors: TROUT, David, Allison; (US).
MCCLINTON, Jeffrey, Byron; (US).
MURR, Keith, McQuilkin; (US).
O'DONNELL, Peter, Clark; (US).
RAYMOND, Hollis, Paul; (US).
SINISI, David, Beatty; (US).
TAYLOR, Attalee, Snarr; (US).
BALTHASER, Andrew, Dewitt; (US).
WHYNE, Richard, Nicholas; (US).
WERTZ, Darrell, Lynn; (US)
Agent: KAPALKA, Robert, J.; Tyco Technology Resources, 4550 New Linden Hill Road, Suite 140, Willmington, DE 19808 (US)
Priority Data:
60/491,493 31.07.2003 US
10/788,880 27.02.2004 US
Abstract: front page image
(EN)A land grid array interconnect (2) comprises a substrate (6) and a plurality of contact assemblies (8) . The substrate has a plurality of apertures (90) therethrough arranged in an array. Each of the contact assemblies includes an insulative member (112) that holds a conductive contact (110), and each said insulative member is positioned in a respective one of the apertures. Each said conductive contact includes an upper contact portion (116) extending above the substrate and a lower contact portion (118) extending below the substrate. The insulative member isolates its respective conductive contact from the substrate
(FR)L'invention concerne une interconnexion (2) de boîtier LGA comprenant un substrat (6) et une pluralité d'ensembles (8) de contact. Le substrat présente une pluralité d'ouvertures (90) en réseau. Chaque ensemble de contact comprend un élément isolant (112) servant de support à un contact conducteur (110), et chaque élément isolant est positionné dans une ouverture correspondante. Chaque contact conducteur comprend une partie supérieure (116) de contact s'étendant au-dessus du substrat et une partie inférieure (118) de contact s'étendant en dessous du substrat. L'élément isolant permet d'isoler le contact conducteur correspondant du substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)