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Machine translation
1. (WO2005013353) METHOD FOR PRODUCING REDUCED-THICKNESS ELECTRONIC COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/013353    International Application No.:    PCT/FR2004/001642
Publication Date: 10.02.2005 International Filing Date: 28.06.2004
IPC:
H01L 23/31 (2006.01), H01L 23/552 (2006.01), H03H 3/08 (2006.01)
Applicants: TEMEX [FR/FR]; 5, rue Carle Vernet, F-92315 Sèvres Cedex (FR) (For All Designated States Except US).
PENTOVELIS, Georgios [GR/FR]; (FR) (For US Only).
MENAGE, Philippe [FR/FR]; (FR) (For US Only).
DUVAL, Pascal [FR/FR]; (FR) (For US Only).
BUREAU, Jean-Marc [FR/FR]; (FR) (For US Only)
Inventors: PENTOVELIS, Georgios; (FR).
MENAGE, Philippe; (FR).
DUVAL, Pascal; (FR).
BUREAU, Jean-Marc; (FR)
Agent: THINAT, Michel; Cabinet Weinstein, 56A, rue du Faubourg Saint-Honoré, F-75008 Paris (FR)
Priority Data:
03/08107 03.07.2003 FR
Title (EN) METHOD FOR PRODUCING REDUCED-THICKNESS ELECTRONIC COMPONENTS
(FR) PROCEDE DE FABRICATION DE COMPOSANTS ELECTRONIQUES D’EPAISSEUR REDUITE
Abstract: front page image
(EN)The invention relates to a method for producing reduced-thickness electronic components. The inventive method consists in placing at least one electronic component (1) by the active face thereof provided with electric contacts (10, 11) on the top face (3) of a support (2) which is provided with electric contacts (5, 6) and with connection jacks (7, 8) on the lower face thereof. Said connection jacks are electrically connected to the electric contacts (5, 6) on the top face of said support by applying a deformable adhesive film (19) to the free external surface of the component (1) and to the top surface (3) of the support and by thinning the top surface of the electronic component, which is opposite to the active surface (12). Said invention can be used for electronic engineering.
(FR)La présente invention concerne un procédé de fabrication de composants électroniques d'épaisseur réduite. Le procédé est caractérisé par le report d'au moins un composant électronique (1) par sa face active comportant des contacts électriques (10, 11) sur la face supérieure (3) à contacts électriques (5, 6), d'un support (2) portant sur sa face inférieure des plots de connexion (7, 8) relies électriquement aux contacts électriques (5, 6) sur la face supérieure du support, par l'application d'un film déformable adhésif (19) sur la surface extérieure libre du composant (1) et la surface supérieure (3) du support et par l’amincissement du composant électronique pqr la face supérieure opposée à la face active (12). L'invention trouve application dans le domaine de l'électronique.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: French (FR)
Filing Language: French (FR)