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1. (WO2005013346) METHOD AND APPARATUS FOR ETCHING DISK-LIKE MEMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/013346    International Application No.:    PCT/JP2004/010808
Publication Date: 10.02.2005 International Filing Date: 29.07.2004
Chapter 2 Demand Filed:    31.01.2005    
IPC:
H01L 21/00 (2006.01), H01L 21/673 (2006.01)
Applicants: KOMATSU DENSHI KINZOKU KABUSHIKI KAISHA [JP/JP]; 25-1, Shinomiya 3-chome, Hiratsuka-shi, Kanagawa 2540014 (JP) (For All Designated States Except US).
MIYAZAKI, Tadamitsu [JP/JP]; (JP) (For US Only).
HIRAYAMA, Kazuya [JP/JP]; (JP) (For US Only).
FUKUNAGA, Hisaya [JP/JP]; (JP) (For US Only).
FUTAMURA, Hiroyasu [JP/JP]; (JP) (For US Only)
Inventors: MIYAZAKI, Tadamitsu; (JP).
HIRAYAMA, Kazuya; (JP).
FUKUNAGA, Hisaya; (JP).
FUTAMURA, Hiroyasu; (JP)
Agent: KIMURA, Takahisa; 6F, Sendai Building, 8-11, Minato 1-chome, Chuo-ku, Tokyo 104-0043 (JP)
Priority Data:
2003-204248 31.07.2003 JP
Title (EN) METHOD AND APPARATUS FOR ETCHING DISK-LIKE MEMBER
(FR) PROCEDE ET DISPOSITIF SERVANT A GRAVER UN ELEMENT CIRCULAIRE PLAT
(JA) 円板状部材のエッチング方法及び装置
Abstract: front page image
(EN)Disclosed are a method and apparatus for etching disk-like members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), a cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).
(FR)L'invention concerne un procédé et un dispositif servant à graver des éléments circulaires plats, en particulier, un procédé et un dispositif servant à graver des tranches de semi-conducteur. Ce procédé consiste à mettre en rotation des tranches (30) et à les graver dans une chambre de gravure (12) remplie par une solution d'attaque chimique, une plaque à alvéoles non rotative (26) étant placée entre deux tranches en rotation (30). Dispositif de gravure supportant des tranches multiples (30) mises en rotation par une tige (16), une plaque à alvéoles (26) étant placée entre deux tranches consécutives (30). Cette plaque à alvéoles (26) présente une surface pratiquement équivalente à celle de la tranche (30).
(JA) 本願発明は、円板状の部材のエッチング方法及びエッチング装置に係り、特に、半導体ウェーハのエッチング方法及びエッチング装置に関する。  エッチング液を満たしたエッチング槽(12)の内部で、ウェーハ(30)を回転させながらエッチングするエッチング方法において、回転するウェーハ(30)とウェーハ(30)との間に回転しないセルプレート(26)を配置する。また、ロッド(16)により複数のウェーハ(30)を支持し回転させるエッチング装置において、ウェーハ(30)とウェーハ(30)との間にセルプレート(26)を配置する。セルプレート(26)の表面積の大きさはウェーハ(30)の表面積と同程度とする。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)