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Machine translation
1. (WO2005011343) CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD OF MANUFACTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/011343    International Application No.:    PCT/US2004/023292
Publication Date: 03.02.2005 International Filing Date: 20.07.2004
IPC:
H05K 1/11 (2006.01), H05K 1/18 (2006.01), H05K 3/46 (2006.01)
Applicants: MOTOROLA, INC. [US/US]; 1303 East Algonquin Road, Schaumburg, IL 60196 (US) (For All Designated States Except US).
ZOLLO, James, A. [US/US]; (US) (For US Only).
ARLEDGE, John, K. [US/US]; (US) (For US Only).
BARRON, John, C. [US/US]; (US) (For US Only).
BURHANCE, Gary, R. [US/US]; (US) (For US Only).
HOLLEY, John [US/US]; (US) (For US Only).
LIEBMAN, Henry, F. [US/US]; (US) (For US Only)
Inventors: ZOLLO, James, A.; (US).
ARLEDGE, John, K.; (US).
BARRON, John, C.; (US).
BURHANCE, Gary, R.; (US).
HOLLEY, John; (US).
LIEBMAN, Henry, F.; (US)
Agent: BROWN, Larry, G.; 8000 West Sunrise Boulevard, Room 1610, Plantation, FL 33322 (US)
Priority Data:
10/626,058 24.07.2003 US
Title (EN) CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD OF MANUFACTURE
(FR) CARTE DE CIRCUITS IMPRIMES A COMPOSANTS INCORPORES ET PROCEDE DE FABRICATION DE CELLE-CI
Abstract: front page image
(EN)A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.
(FR)L'invention concerne un ensemble de substrat (10) et un procédé de fabrication de celui-ci, lequel comprend au moins un composant incorporé (25) dans un trou de raccordement (24) du centre du substrat (22), une première couche adhésive (20) couplée au centre du substrat et une seconde couche adhésive (26) sur au moins des parties d'une surface supérieure du centre du substrat et au-dessus des parties du composant incorporé. L'ensemble de substrat peut également comprendre une première couche conductrice (18) adhérée sur la surface inférieure du centre du substrat et une seconde couche conductrice (28) sur la seconde couche adhésive. L'ensemble de substrat peut également comprendre une interconnexion (36) entre une surface conductrice du composant incorporé et au moins une couche parmi les première et seconde couches conductrices. L'interconnexion peut être formée à travers une ouverture (34) exposant au moins de manière temporaire au moins une surface conductrice (32) du composant incorporé.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)