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1. (WO2005010936) EDGE BEAD CONTROL METHOD AND APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2005/010936 International Application No.: PCT/US2004/022039
Publication Date: 03.02.2005 International Filing Date: 08.07.2004
IPC:
H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants: FINISAR CORPORATION[US/US]; 1308 Moffett Park Drive Sunnyvale, CA 94089-1133, US (AllExceptUS)
Inventors: LI, Bernard, O.; US
Agent: MASCHOFF, Eric, L. ; Workman Nydegger 1000 Eagle Gate Tower 60 East South Temple Salt Lake City, UT 84111, US
Priority Data:
10/623,35118.07.2003US
Title (EN) EDGE BEAD CONTROL METHOD AND APPARATUS
(FR) PROCEDE ET APPAREIL EMPECHANT LA FORMATION D'UN BOURRELET DE BORD
Abstract:
(EN) Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.
(FR) L'invention concerne des procédés et des dispositifs pour la manipulation de tranches de silicium pendant leur traitement. Dans un mode de réalisation, l'invention concerne un appareil servant à maintenir une tranche de silicium. Cet appareil de maintien de tranche de silicium présente une poche destinée à recevoir une tranche de silicium et peut être muni d'un mécanisme servant à la fixation de la tranche de silicium dans la poche. L'invention concerne également des procédés de préparation d'une tranche de silicium en vue de processus de fabrication, faisant appel à un tel appareil de maintien de tranches de silicium. Ces procédés peuvent comprendre l'opération consistant à appliquer une couche de photorésist sur la surface de la tranche de silicium.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)