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Machine translation
1. (WO2005010616) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/010616    International Application No.:    PCT/JP2004/011198
Publication Date: 03.02.2005 International Filing Date: 29.07.2004
Chapter 2 Demand Filed:    15.04.2005    
IPC:
G03F 7/023 (2006.01)
Applicants: ASAHI KASEI EMD CORPORATION [JP/JP]; 23-7, Nishi-shinjuku 1-chome Shinjuku-ku, Tokyo 1600023 (JP) (For All Designated States Except US).
SASAKI, Takahiro [JP/JP]; (JP) (For US Only).
FUJIYAMA, Hideyuki [JP/JP]; (JP) (For US Only)
Inventors: SASAKI, Takahiro; (JP).
FUJIYAMA, Hideyuki; (JP)
Agent: ASAMURA, Kiyoshi; Room 331, New Ohtemachi Bldg. 2-1, Ohtemachi 2-chome Chiyoda-ku, Tokyo 1000004 (JP)
Priority Data:
2003-282213 29.07.2003 JP
Title (EN) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RESINE PHOTOSENSIBLE POSITIVE
(JA) ポジ型感光性樹脂組成物
Abstract: front page image
(EN)Disclosed is a positive photosensitive resin composition which comprises 100 parts by mass of a hydroxy polyamide, 1-30 parts by mass of a phenolic compound having only one benzene ring, and 1-100 parts by mass of a photosensitive diazoquinone compound.
(FR)L'invention concerne une composition de résine photosensible positive qui contient 100 parties en masse d'un hydroxy polyamide, de 1 à 30 parties en masse d'un composé phénolique possédant un seul noyau benzène et de 1 à 100 parties en masse d'un composé de diazoquinone photosensible.
(JA) ヒドロキシポリアミド100質量部とベンゼン環1つのみを有するフェノール化合物1~30質量部と感光性ジアゾキノン化合物1~100質量部とを含んでなるポジ型感光性樹脂組成物。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)