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1. WO2005006411 - FEEDFORWARD, FEEDBACK WAFER TO WAFER CONTROL METHOD FOR AN ETCH PROCESS

Publication Number WO/2005/006411
Publication Date 20.01.2005
International Application No. PCT/US2004/016404
International Filing Date 24.05.2004
IPC
G06F 19/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
19Digital computing or data processing equipment or methods, specially adapted for specific applications
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
G05B 19/41875
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
41875characterised by quality surveillance of production
G05B 2219/31265
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
31From computer integrated manufacturing till monitoring
31265Control process by combining history and real time data
G05B 2219/32195
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
32Operator till task planning
32195Feedforward quality control
G05B 2219/45031
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
45Nc applications
45031Manufacturing semiconductor wafers
Y02P 90/02
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
90Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Applicants
  • TOKYO ELECTRON LIMITED [JP]/[JP] (AllExceptUS)
  • FUNK, Merritt [US]/[US] (UsOnly)
Inventors
  • FUNK, Merritt
Agents
  • KARCESKI, Jeffrey, D.
Priority Data
10/609,12930.06.2003US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FEEDFORWARD, FEEDBACK WAFER TO WAFER CONTROL METHOD FOR AN ETCH PROCESS
(FR) PROCEDE DE COMMANDE PLAQUETTE PAR PLAQUETTE PAR ACTION DIRECTE ET RETROACTION DESTINE A UN PROCEDE DE GRAVURE
Abstract
(EN)
A method of using a run-to-run (R2R) controller to provide wafer-to-wafer (W2W) control in a semiconductor processing system is provided. The R2R controller includes a feed-forward (FF) controller, a process model controller, a feedback (FB) controller, and a process controller. The R2R controller uses feed-forward data, modeling data, feedback data, and process data to update a process recipe on a wafer-to-wafer time frame.
(FR)
L'invention concerne un procédé d'utilisation d'une unité de commande séquentielle (R2R) permettant de mettre en oeuvre une commande plaquette par plaquette (W2W) dans un système de traitement semi-conducteur. L'unité de commande R2R comprend une unité de commande à action directe (FF), une unité de commande d'un modèle de procédé, une unité de commande de rétroaction (FB) et une unité de commande de procédé. L'unité de commande R2R met en oeuvre des données d'action directe, des données de modelage, des données de rétroaction et des données de procédé afin de mettre à jour une réponse du procédé plaquette par plaquette.
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