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1. WO2004113021 - DATA PROCESSING FOR MONITORING CHEMICAL MECHANICAL POLISHING

Publication Number WO/2004/113021
Publication Date 29.12.2004
International Application No. PCT/US2004/019171
International Filing Date 16.06.2004
Chapter 2 Demand Filed 18.01.2005
IPC
B24B 37/04 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 49/10 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
10involving electrical means
CPC
B24B 37/005
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
B24B 37/013
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 37/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 49/10
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
10involving electrical means
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • APPLIED MATERIALS, INC. [US]/[US] (AllExceptUS)
Inventors
  • SWEDEK, Boguslaw, A.
  • JOHANSSON, Nils
  • BIRANG, Manoocher
Agents
  • GOREN, David, J.
Priority Data
10/464,67318.06.2003US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) DATA PROCESSING FOR MONITORING CHEMICAL MECHANICAL POLISHING
(FR) TRAITEMENT DE DONNEES POUR LA SURVEILLANCE D'UN POLISSAGE MECANO-CHIMIQUE
Abstract
(EN) Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate (10) and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
(FR) L'invention concerne des procédés et un appareil permettant de mettre en oeuvre des techniques pour la surveillance du polissage d'un substrat. Deux ou plusieurs points de données sont acquis, chaque point de données présentant une valeur variant en fonction des caractéristiques à l'intérieur d'une zone de détection d'un détecteur et correspondant à une position relative du substrat (10) et du détecteur lorsque la zone de détection traverse le substrat. Un ensemble de points de référence est utilisé pour modifier les points de données acquis. Cette modification permet de compenser les distorsions dans les points de données acquis occasionnées lorsque la zone de détection traverse le substrat. Sur la base des points de données modifiés, une propriété locale du substrat est évaluée en vue d'une surveillance du polissage.
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