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1. WO2004109584 - METHOD FOR PRODUCING AN INTEGRATED FINGERPRINT SENSOR, SENSOR CIRCUIT ARRANGEMENT, AND INJECTION ARRANGEMENT

Publication Number WO/2004/109584
Publication Date 16.12.2004
International Application No. PCT/EP2004/050868
International Filing Date 19.05.2004
Chapter 2 Demand Filed 08.12.2004
IPC
B60R 16/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02electric
B81B 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
1Devices without movable or flexible elements, e.g. microcapillary devices
G06K 9/00 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
G06K 19/077 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
H01L 21/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
CPC
G06V 40/1329
Applicants
  • INFINEON TECHNOLOGIES AG [DE]/[DE] (AllExceptUS)
  • LINDNER, Christine [DE]/[DE] (UsOnly)
  • WÖRZ, Andreas [DE]/[DE] (UsOnly)
Inventors
  • LINDNER, Christine
  • WÖRZ, Andreas
Agents
  • KARL, Frank
Priority Data
10325863.906.06.2003DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM HERSTELLEN EINES INTEGRIERTEN FINGERABDRUCKSENSORS SOWIE SENSORSCHALTUNGSANORDNUNG UND EINSPRITZANORDNUNG
(EN) METHOD FOR PRODUCING AN INTEGRATED FINGERPRINT SENSOR, SENSOR CIRCUIT ARRANGEMENT, AND INJECTION ARRANGEMENT
(FR) PROCEDE DE FABRICATION D'UN CAPTEUR D'EMPREINTES DIGITALES INTEGRE, CIRCUIT DE CAPTEUR ET DISPOSITIF D'INJECTION
Abstract
(DE) Verfahren zum Herstellen eines Erläutert wird unter anderem ein verfahren zum Herstellen eines Fingerabdrucksensors mit schmutzabweisender Schutz schicht. Zum Aufbringen der Schutzschicht wird ein Verfahren eingesetzt, bei dem ein Ausgangsmaterial für die Schutz schicht in einen Spalt zwischen einem Substrat des Sensors und einer Druckplatte eingespritzt wird, siehe Verfahrensschritt (112). Auf diese Weise lassen sich stark schmutzabweisende Schutzschichten ohne Fototechnik und ohne Schleifprozesse strukturieren.
(EN) The invention relates to, inter alia, a method for producing a fingerprint sensor comprising a dirt-repellent protective layer. In order to apply the protective layer, a starting material therefor is injected into a gap between a substrate of the sensor and a pressure plate, cf. method step (112). In this way, highly dirt-repellent protective layers can be structured without having recourse to photographic technology and abrasive processes.
(FR) L'invention concerne un procédé de fabrication d'un capteur d'empreintes digitales présentant une couche de protection anti-salissures. L'application de la couche de protection est effectuée au moyen d'un procédé consistant à injecter un matériau initial, destiné à cette couche de protection, dans une fente comprise entre un substrat du capteur et une plaque de compression (voir étape 112). De cette manière, il est possible de structurer des couches de protection ayant un fort effet anti-salissures sans recourir à des techniques photographiques ou à des processus de rectification.
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