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1. WO2004107412 - WAFER TREATMENT SYSTEM HAVING LOAD LOCK AND BUFFER

Publication Number WO/2004/107412
Publication Date 09.12.2004
International Application No. PCT/US2004/016074
International Filing Date 21.05.2004
IPC
H01L 21/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/67213
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67207comprising a chamber adapted to a particular process
67213comprising at least one ion or electron beam chamber
H01L 21/67745
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67745characterized by movements or sequence of movements of transfer devices
H01L 21/67763
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Y10S 414/139
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
139including wafer charging or discharging means for vacuum chamber
Y10S 414/141
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
141includes means for gripping wafer
Applicants
  • AXCELIS TECHNOLOGIES INC. [US]/[US] (AllExceptUS)
  • MITCHELL, Robert [US]/[US] (UsOnly)
  • WEED, Allan [US]/[US] (UsOnly)
  • GUELER, Richard [US]/[US] (UsOnly)
Inventors
  • MITCHELL, Robert
  • WEED, Allan
  • GUELER, Richard
Priority Data
10/444,01922.05.2003US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) WAFER TREATMENT SYSTEM HAVING LOAD LOCK AND BUFFER
(FR) SYSTEME DE TRAITEMENT DE PIECES A TRAVAILLER EQUIPE D'UN VERROU DE CHARGE ET D'UN TAMPON
Abstract
(EN) A transfer system for use with a tool for treating a work-piece at sub-atmospheric pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for treatment of work-pieces placed at a work-piece treatment station within the low pressure region. Multiple work-piece isolation load locks transfer work-pieces, one or two at a time, from a higher pressure region to the lower pressure for treatment and back to said higher pressure subsequent to said treatment. A first robot transfers work-pieces within the low pressure region from the load locks to a treatment station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the multiple work-piece isolation load locks from a source of said work-pieces prior to treatment and to a destination of said work-pieces after said treatment.
(FR) L'invention concerne un système de transfert utilisé avec un outil en vue de traiter une pièce à travailler à une pression sous-atmosphérique notamment un implanteur ionique destiné à implanter des plaquettes de silicium. L'enceinte définit une zone de basse pression destinée au traitement des pièces à travailler placées au niveau d'une station de traitement de pièces à travailler dans la zone de basse pression. Les verrous de charge d'isolation de pièces à travailler multiples transfèrent les pièces à travailler, une ou deux en même temps, d'une zone à pression plus élevée vers une zone à pression inférieure en vue du traitement, puis les replacent dans la zone à pression plus élevée après traitement. Un premier robot transfère les pièces à travailler dans la zone basse pression à partir des verrous de charge vers une station de traitement située dans la zone de basse pression. Plusieurs autres robots placés à l'extérieur de la zone de basse pression transfèrent les pièces à travailler de et vers les verrous de charge d'isolation de pièces à travailler multiples à partir d'une source de ces pièces à travailler avant traitement et vers une destination pour ces pièces à travailler après traitement.
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