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Machine translation
1. (WO2004101428) METHODS AND APPARATUS FOR ATTACHING MEMS DEVICES TO HOUSING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/101428    International Application No.:    PCT/US2004/014268
Publication Date: 25.11.2004 International Filing Date: 07.05.2004
Chapter 2 Demand Filed:    06.12.2004    
IPC:
B81B 7/00 (2006.01)
Applicants: HONEYWELL INTERNATIONAL INC. [US/US]; 101 Columbia Road, P.O. Box 2245, Morristown, NJ 07960 (US) (For All Designated States Except US).
DCAMP, Jon, B. [US/US]; (US) (For US Only).
GLENN, Max, C. [US/US]; (US) (For US Only).
DUNAWAY, Lori, A. [US/US]; (US) (For US Only).
CURTIS, Harlan, L. [US/US]; (US) (For US Only)
Inventors: DCAMP, Jon, B.; (US).
GLENN, Max, C.; (US).
DUNAWAY, Lori, A.; (US).
CURTIS, Harlan, L.; (US)
Agent: HOIRIIS, David; Honeywell International Inc., 101 Columbia Road, P.O. Box 2245, Morristown, NJ 07960 (US)
Priority Data:
10/431,420 07.05.2003 US
Title (EN) METHODS AND APPARATUS FOR ATTACHING MEMS DEVICES TO HOUSING
(FR) PROCEDES ET APPAREIL PERMETTANT DE FIXER DES DISPOSITIFS MEMS SUR UN BOITIER
Abstract: front page image
(EN)A method for increasing the bonding strength between a die (110) and a housing (202) for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters (220) of contact material onto a bottom surface (240) of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts (228), and the die to a thermocompression bonding process.
(FR)L'invention concerne un procédé permettant d'augmenter la résistance à la liaison entre une puce (110) et un boîtier (202) pour la puce. Un dispositif à système mécanique microélectrique (MEMS) est formé sur la puce. Ce procédé consiste à déposer une pluralité d'agglomérats (220) de matériau de contact sur une surface de fond (240) du boîtier, à placer la puce sur les agglomérats et à soumettre le boîtier, les contacts agglomérés (228) et la puce à un processus de soudage par thermocompression.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)