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Pub. No.:    WO/2004/100264    International Application No.:    PCT/JP2004/006496
Publication Date: 18.11.2004 International Filing Date: 07.05.2004
H01L 23/538 (2006.01), H01L 25/16 (2006.01), H05K 1/02 (2006.01), H05K 1/18 (2006.01), H05K 3/46 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501 (JP) (For All Designated States Except US).
HANDA, Hiroyuki; (For US Only).
NAKATANI, Seiichi; (For US Only).
HIRANO, Koichi; (For US Only).
INOUE, Osamu; (For US Only).
ISHIKAWA, Akihiro; (For US Only).
YOSHIDA, Tsunenori; (For US Only)
Inventors: HANDA, Hiroyuki; .
NAKATANI, Seiichi; .
HIRANO, Koichi; .
INOUE, Osamu; .
ISHIKAWA, Akihiro; .
YOSHIDA, Tsunenori;
Agent: SUMIDA, Yoshihiro; Arco Patent Office 3rd Fl. Bo-eki Bldg. 123-1, Higashi-machi Chuo-ku, Kobe-shi Hyogo 6500031 (JP)
Priority Data:
2003-132066 09.05.2003 JP
(JA) 回路素子内蔵モジュール
Abstract: front page image
(EN)In a module (51) including circuit elements, a plurality of wires (12), which are generally two-dimensionally formed, are multi-layered via electrically insulating material (11), which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module (51) further includes a heat sink member (13) that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element (14), which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.
(FR)Dans un module (51) comprenant des éléments de circuit, une pluralité de fils (12) globalement bidimensionnels forment une superposition de couches avec un matériau diélectrique (11) composé d'un mélange d'au moins une charge et une résine diélectrique. Un ou plusieurs éléments de circuit sont connectés aux fils et au moins une partie de ces éléments de circuit sont intégrés dans le matériau diélectrique. Le module (51) comprend également un drain thermique (13) présentant une conductivité thermique supérieure à celle du matériau diélectrique. Lorsque l'on observe le module de côté, le drain thermique recouvre un élément de circuit (14) des éléments de circuit, présentant la plus forte élévation de température au moins dans le module.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)