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Machine translation
1. (WO2004100256) DEVICE COMPRISING A SEMICONDUCTOR CIRCUIT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/100256    International Application No.:    PCT/DE2004/000821
Publication Date: 18.11.2004 International Filing Date: 20.04.2004
IPC:
H01L 21/762 (2006.01)
Applicants: ROBERT BOSCH GMBH [DE/DE]; Postfach 30 02 20, 70422 Stuttgart (DE) (For All Designated States Except US).
SCHELLING, Christoph [DE/DE]; (DE) (For US Only).
VOSSENBERG, Heinz-Georg [DE/DE]; (DE) (For US Only).
DUELL, Andreas [DE/DE]; (DE) (For US Only).
SCHAEFER, Frank [DE/DE]; (DE) (For US Only).
BENZEL, Hubert [DE/DE]; (DE) (For US Only).
NITSCHE, Juergen [DE/DE]; (DE) (For US Only).
JUNGER, Andreas [DE/DE]; (DE) (For US Only).
MUCHOW, Joerg [DE/DE]; (DE) (For US Only)
Inventors: SCHELLING, Christoph; (DE).
VOSSENBERG, Heinz-Georg; (DE).
DUELL, Andreas; (DE).
SCHAEFER, Frank; (DE).
BENZEL, Hubert; (DE).
NITSCHE, Juergen; (DE).
JUNGER, Andreas; (DE).
MUCHOW, Joerg; (DE)
Common
Representative:
ROBERT BOSCH GMBH; Postfach 30 02 20, 70422 Stuttgart (DE)
Priority Data:
103 20 201.3 07.05.2003 DE
Title (DE) VORRICHTUNG MIT EINER HALBLEITERSCHALTUNG
(EN) DEVICE COMPRISING A SEMICONDUCTOR CIRCUIT
(FR) DISPOSITIF MUNI D'UN CIRCUIT A SEMI-CONDUCTEURS
Abstract: front page image
(DE)Es wird eine Vorrichtung mit einer Halbleiterschaltung (21) und einem Substrat (10) vorgeschlagen, wobei eine thermische und/oder mechanische Entkopplung mittels einer Entkopplungsstruktur (30, 31) vorgesehen ist.
(EN)The invention relates to a device comprising a semiconductor circuit (21) and a substrate (10). A thermal and/or mechanical decoupling is provided by a decoupling structure (30, 31).
(FR)L'invention concerne un dispositif muni d'un circuit à semi-conducteurs (21) et d'un substrat (10). Il est prévu un découplage thermique et/ou mécanique au moyen d'une structure de découplage (30, 31).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: German (DE)
Filing Language: German (DE)