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1. (WO2004099065) VACUUM PACKAGE FABRICATION OF INTEGRATED CIRCUIT COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/099065    International Application No.:    PCT/US2004/012131
Publication Date: 18.11.2004 International Filing Date: 19.04.2004
IPC:
B81B 7/00 (2006.01), H01L 21/00 (2006.01), H01L 21/30 (2006.01), H01L 21/44 (2006.01), H01L 21/46 (2006.01), H01L 21/48 (2006.01), H01L 23/12 (2006.01)
Applicants: RAYTHEON COMPANY [US/US]; 870 Winter Street, Waltham, MA 2451 (US) (For All Designated States Except US)
Inventors: SYLLAIOS, Athanasios, J.; (US).
GOOCH, Roland, W.; (US).
SCHIMERT, Thomas, R.; (US)
Agent: JOHNSON, Jay, B.; Baker Botts LLP, Suite 600, 2001 Ross Avenue, Dallas, TX 75201 (US)
Priority Data:
10/428,627 02.05.2003 US
Title (EN) VACUUM PACKAGE FABRICATION OF INTEGRATED CIRCUIT COMPONENTS
(FR) FABRICATION DE BOITIERS SOUS VIDE DE COMPOSANTS DE CIRCUITS INTEGRES
Abstract: front page image
(EN)A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.
(FR)La présente invention concerne un procédé de fabrication de couvercles de dispositifs à circuits intégrés qui consiste à créer une cavité couvercle à la surface d'une plaquette couvercle, à former une surface d'étanchéité sur la plaquette couvercle qui entoure la cavité couvercle, et à former une tranchée sur la plaquette couvercle entre la cavité couvercle et la surface d'étanchéité. La structure résultante absorbe la matière superficielle d'étanchéité en excès et empêche une telle matière de pénétrer dans la cavité couvercle.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)