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Machine translation
1. (WO2004098874) COMPOSITE FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/098874    International Application No.:    PCT/JP2004/006186
Publication Date: 18.11.2004 International Filing Date: 28.04.2004
IPC:
B32B 15/08 (2006.01)
Applicants: SHINMAYWA INDUSTRIES, LTD. [JP/JP]; 1-1, Shinmeiwa-cho Takarazuka-shi, Hyogo 665-8550 (JP) (For All Designated States Except US).
NOSE, Koichi; (For US Only).
SASAGAWA, Koichi; (For US Only).
FURUTSUKA, Takeshi; (For US Only).
TAKIGAWA, Shiro; (For US Only)
Inventors: NOSE, Koichi; .
SASAGAWA, Koichi; .
FURUTSUKA, Takeshi; .
TAKIGAWA, Shiro;
Agent: SUMIDA, Yoshihiro; ARCO PATENT OFFICE Bo-eki Bldg., 3rd Fl. 123-1, Higashimachi, Chuo-ku Kobe-shi, Hyogo 650-0031 (JP)
Priority Data:
2003-129444 07.05.2003 JP
Title (EN) COMPOSITE FILM
(FR) FILM COMPOSITE
(JA) 複合フィルム
Abstract: front page image
(EN)A composite film is disclosed wherein a binder film (2A) composed of an HMDSO polymer which is obtained by plasma polymerization of an HMDSO monomer is formed on a polyimide substrate (1) and a metal thin film (3) composed of Cu is formed on this binder film (2A).
(FR)L'invention concerne un film composite dans lequel un film liant (2A) composé d'un polymère HMDSO qui est obtenu par polymérisation au plasma d'un monomère HMDSO est formé sur un substrat polyimide (1) et un film mince métallique (3) composé de Cu est formé sur ce film liant (2A).
(JA)本発明の複合フィルムは、ポリイミド基板(1)上に、HMDSOモノマをプラズマ重合させたHMDSOポリマからなるバインダ膜(2A)が形成され、このバインダ膜(2A)上に、Cuからなる金属薄膜(3)を形成する。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)