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1. (WO2004098255) ELECTRIC CIRCUIT AND ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2004/098255 International Application No.: PCT/JP2004/006012
Publication Date: 11.11.2004 International Filing Date: 26.04.2004
IPC:
H01L 33/48 (2010.01)
Applicants: ITO, Ryo[JP/JP]; JP
ITO, Jun[JP/JP]; JP (UsOnly)
SANKO LITE INDUSTRIES CO., LTD.[JP/JP]; 2-29-1, Miyauchi, Nakahara-ku Kawasaki-shi, Kanagawa 211-0051, JP (AllExceptUS)
SANKO-TEC CO., LTD.[JP/JP]; 6-22-10, Kami-kodanaka Nakahara-ku Kawasaki-shi, Kanagawa 211-0053, JP (AllExceptUS)
Inventors: ITO, Ryo; JP
ITO, Jun; JP
Agent: HIRAISHI, Toshiko; 1-18-15, Nishi-Shinbashi Minato-ku, Tokyo 105-0003, JP
Priority Data:
2003-12183525.04.2003JP
Title (EN) ELECTRIC CIRCUIT AND ELECTRONIC COMPONENT
(FR) CIRCUIT ELECTRIQUE ET COMPOSANT ELECTRONIQUE
(JA) 電気回路および電子部品
Abstract: front page image
(EN) An electric circuit, and an electronic component and an electronic circuit capable of enhancing radiation characteristics, or eliminating or reducing a dielectric loss, characterized in that a conduction layer by plating is formed on the exposed surface portions of the primary forming material (111) and the secondary forming material (31) of a composite substrate consisting of the primary forming material, the secondary forming material and a tertiary forming material (32), and the secondary forming material and the tertiary forming material are removed.
(FR) Un circuit électrique, un composant électronique et un circuit électronique sont capables d'améliorer les caractéristiques de rayonnement ou d'éliminer ou de réduire la perte diélectrique. Ils sont caractérisés en ce qu'une couche de conduction est formée par plaquage sur les parties de surface exposées du matériau de formation primaire (111) et que le matériau de formation secondaire (21) d'un substrat composite est constitué d'un matériau de formation primaire, d'un matériau de formation secondaire et d'un matériau de formation tertiaire (32), et que les matériaux de formation secondaire et tertiaire sont enlevés.
(JA) 放熱特性を向上させることができ、あるいは誘電損失をなくすことないし低減することができる電気回路、電子部品および電子回路を提供する。一次成形材料111と、二次成形材料31と、三次成形材料32とからなる複合基体の前記一次成形材料および前記二次成形材料の露出表面部分にメッキによる導電層を形成し、前記二次成形材料および前記三次成形材料を除去してなることを特徴とする。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)