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Machine translation
1. (WO2004097893) METHOD OF RESTORING ENCAPSULATED INTEGRATED CIRCUIT DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/097893    International Application No.:    PCT/US2002/040105
Publication Date: 11.11.2004 International Filing Date: 25.03.2003
Chapter 2 Demand Filed:    14.07.2003    
IPC:
G01R 31/00 (2006.01)
Applicants: SMITHS AEROSPACE, INC. [US/US]; Grand Rapids Division, 3290 Patterson Avenue, S.E., Grand Rapids, MI 49512-1991 (US) (For All Designated States Except US).
VISSER, Timothy, Calvin [US/US]; (US) (For US Only).
UHL, Gary, Michael [US/US]; (US) (For US Only)
Inventors: VISSER, Timothy, Calvin; (US).
UHL, Gary, Michael; (US)
Agent: VISSERMAN, Peter; Varnum, Riddering, Schmidt & Howlett LLP, Bridgewater Place, P.O. Box 352, Grand Rapids, MI 49501-0352 (US)
Priority Data:
10/020,628 14.12.2001 US (Considered void 26.04.2004)
Title (EN) METHOD OF RESTORING ENCAPSULATED INTEGRATED CIRCUIT DEVICES
(FR) PROCEDE DE RESTAURATION DE DISPOSITIFS A CIRCUITS INTEGRES ENCAPSULES
Abstract: front page image
(EN)A method for restoring integrated circuit devices in an encapsulated array of integrated circuit devices includes the steps of testing the array and applying a voltage signal to pins appearing to be disconnected from an element internal to the array.
(FR)L'invention concerne un procédé de restauration de dispositifs à circuits intégrés dans un réseau encapsulé de dispositifs à circuits intégrés consistant à tester le réseau et à appliquer un signal de tension sur les broches qui semblent déconnectées d'un élément interne au réseau.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)