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1. (WO2004095538) DENSIFYING DEPOSITED FILMS ON INTEGRATED CIRCUITS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/095538    International Application No.:    PCT/US2004/008554
Publication Date: 04.11.2004 International Filing Date: 19.03.2004
IPC:
G01T 1/24 (2006.01)
Applicants: VARIAN MEDICAL SYSTEMS TECHNOLOGIES, INC. [US/US]; 3100 Hansen Way, Palo Alto, CA 94304 (US) (For All Designated States Except US).
ZENTAI, George [US/HU]; (US) (For US Only).
SHAH, Kanai, S. [US/US]; (US) (For US Only).
BENNETT, Paul, R. [US/US]; (US) (For US Only).
KLUGERMAN, Mikhail [US/US]; (US) (For US Only).
DMITRIEV, Yuri [US/US]; (US) (For US Only)
Inventors: ZENTAI, George; (US).
SHAH, Kanai, S.; (US).
BENNETT, Paul, R.; (US).
KLUGERMAN, Mikhail; (US).
DMITRIEV, Yuri; (US)
Agent: MALLIE, Michael, J.; Blakely, Sokoloff, Taylor & Zafman LLP, 7th Floor, 12400 Wilshire Boulevard, Los Angeles, CA 90025 (US)
Priority Data:
10/405,599 01.04.2003 US
Title (EN) DENSIFYING DEPOSITED FILMS ON INTEGRATED CIRCUITS
(FR) DENSIFICATION DE FILMS DEPOSES SUR DES CIRCUITS INTEGRES
Abstract: front page image
(EN)Densifying a deposited semiconducting film on a substrate is described. According to one embodiment of the invention, isostatic pressure (520) is used to densify the semiconducting film on the substrate.
(FR)L'invention concerne la densification d'un film semi-conducteur déposé sur un substrat. Selon un mode de réalisation de cette invention, la pression isostatique est utilisée pour densifier le film semi-conducteur sur le substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)