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Machine translation
1. (WO2004094688) PVD TARGET/BACKING PLATE CONSTRUCTIONS; AND METHODS OF FORMING PVD TARGET/BACKING PLATE CONSTRUCTIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/094688    International Application No.:    PCT/US2004/008343
Publication Date: 04.11.2004 International Filing Date: 17.03.2004
IPC:
C23C 14/34 (2006.01)
Applicants: HONEYWELL INTERNATIONAL INC. [US/US]; 101 Columbia Road, P.O. Box 2245, Morristown, NJ 07962 (US) (For All Designated States Except US).
CLARK, Brett, M. [US/US]; (US) (For US Only).
YI, Wuwen [CN/US]; (US) (For US Only).
SMITS, Roberta, L. [US/US]; (US) (For US Only).
BROWN, Alan [US/US]; (US) (For US Only)
Inventors: CLARK, Brett, M.; (US).
YI, Wuwen; (US).
SMITS, Roberta, L.; (US).
BROWN, Alan; (US)
Agent: LATWESEN, David, G.; Wells, St. John P.S., Suite 1300, 601 W. First Avenue, Spokane, WA 92201 (US)
Priority Data:
60/460,151 02.04.2003 US
Title (EN) PVD TARGET/BACKING PLATE CONSTRUCTIONS; AND METHODS OF FORMING PVD TARGET/BACKING PLATE CONSTRUCTIONS
(FR) CONSTRUCTIONS DE PLAQUES CIBLE/SUPPORT PVD, ET PROCEDE DE FORMATION DE CONSTRUCTIONS DE PLAQUES CIBLE/SUPPORT PVD
Abstract: front page image
(EN)The invention encompasses a construction in which a PVD target (18) is bonded to a backing plate (16). The target (18) has a bonding surface (19) utilized in forming the bond to the backing plate (16), and the backing plate (16) has a bonding surface (19) utilized in forming the bond to the target (18). One or more holes (100) extend into the target (18) through the target bonding surface (19) and/or one or more holes extend into the backing through the backing plate, bonding surface (19). The invention also includes methods of forming PVD target/backing plate constructions (104), and methods of utilizing holes extending into one or both of the target (18) and the backing plate (19) of the target/backing plate construction (104) during ultrasound determination of a thickness of the target (18).
(FR)L'invention concerne une construction, dans laquelle une cible PVD (18) est liée à une plaque de support (16). La cible (18) présente une surface de liaison (19) utilisée dans la formation de la liaison avec la plaque de support (16), et celle-ci (16) présente une surface de liaison (19) utilisée dans la formation de la liaison avec la cible (18). Un ou plusieurs orifices (100) s'étendent vers la cible (18) et traversent la surface de liaison de cible (19) et/ou un ou plusieurs orifices s'étendent dans le support et traversent la surface de liaison de plaque de support (19). L'invention concerne également des procédés de formation de constructions (104) de plaques cible/support PVD et des procédés d'utilisation des orifices s'étendant dans un ou plusieurs des éléments suivants, à savoir la cible (18) et la plaque de support (19) de la construction (104) de plaque cible/support pendant la détermination ultrasonore de l'épaisseur de la cible (18).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)