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Machine translation
1. (WO2004094682) IMPROVED COATING FOR SILVER PLATED CIRCUITS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/094682    International Application No.:    PCT/US2004/007773
Publication Date: 04.11.2004 International Filing Date: 15.03.2004
IPC:
C23C 18/42 (2006.01), H05K 3/24 (2006.01), H05K 3/28 (2006.01)
Applicants: MACDERMID, INCORPORATED [US/US]; 245 Freight Street, Waterbury, CT 06702 (US) (For All Designated States Except US)
Inventors: REDLINE, Ronald; (US).
ANGELONE, David; (US).
CASTALDI, Steven, A.; (US).
TOSCANO, Lenora; (US)
Agent: CORDANI, John, L.; Carmody & Torrance LLP, 50 Leavenworth Street, Waterbury, CT 06721-1110 (US)
Priority Data:
10/412,932 14.04.2003 US
Title (EN) IMPROVED COATING FOR SILVER PLATED CIRCUITS
(FR) REVETEMENTS AMELIORES POUR CIRCUITS A PLACAGE D'ARGENT
Abstract: front page image
(EN)A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.
(FR)L'invention concerne un procédé permettant d'améliorer l'aptitude au soudage d'une surface métallique, consistant à plaquer la surface métallique avec plaquage argent par immersion ou par dépôt autocatalytique avant le soudage, l'immersion étant suivie d'un traitement avec une couche polymère alcaline contenant des polymères vinyliques aqueux, des polymères acryliques aqueux, des agents antifongiques et un composé benzotriazole ou benzimidazole afin de produire un dépôt résistant à l'électromigration et permettant de former un revêtement antiternissure et anticorrosion sur la surface.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)