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1. WO2004075221 - MICRO FUSE

Publication Number WO/2004/075221
Publication Date 02.09.2004
International Application No. PCT/GB2004/000655
International Filing Date 18.02.2004
IPC
H01L 23/525 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
525with adaptable interconnections
CPC
H01L 23/5256
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
525with adaptable interconnections
5256comprising fuses, i.e. connections having their state changed from conductive to non-conductive
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • CAVENDISH KINETICS LIMITED [GB]/[GB] (AllExceptUS)
  • VAN KAMPEN, Robert [NL]/[NL] (UsOnly)
  • SMITH, Charles, Gordon [GB]/[GB] (UsOnly)
  • KAZINSKI, Robert [NL]/[NL] (UsOnly)
Inventors
  • VAN KAMPEN, Robert
  • SMITH, Charles, Gordon
  • KAZINSKI, Robert
Agents
  • Gill Jennings & Every Broadgate House
Priority Data
03251007.519.02.2003EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MICRO FUSE
(FR) MICROFUSIBLE
Abstract
(EN)
A micro fuse for use in a semiconductor device. The micro fuse comprises an insulating substrate and an elongate metal fuse member, the fuse member being supported at either end on the substrate and including at least one fuse region suspended out of contact with the substrate and shaped such that, in use, a predetermined current can be applied to it to make it non-conducting. At least one barrier may be formed between the fuse region of the fuse member and the insulator. The fuse member may be formed from a readily oxidisable metal, such as Titanium, Tungsten, Tantalum, Copper or Aluminium. The fuse member may have two or more fuse regions, with a region between adjacent fuse regions being supported by a metal track. In this case, the fuse member may also be supported on the substrate via one or more inter layers.
(FR)
La présente invention concerne un microfusible conçu pour être utilisé dans un dispositif semi-conducteur. Ce microfusible comprend un substrat isolant et un élément fusible métallique allongé, ledit élément fusible étant supporté en ses deux extrémités sur le substrat et incluant au moins une région fusible suspendue sans contact avec le substrat et ayant une forme telle que, en cours d'utilisation, un courant préétabli puisse être appliqué à cette région pour la rendre non conductrice. Une barrière au moins peut être formée entre la région fusible de l'élément fusible et l'isolant. L'élément fusible peut être formé à partir d'un métal facilement oxydable, du type titane, tungstène, tantale, cuivre ou aluminium. L'élément fusible peut comporter au moins deux régions fusibles, l'une de ces régions situées entre des régions fusibles adjacentes étant supportée par une piste métallique. Dans ce cas, l'élément fusible peut être supporté sur le substrat par l'intermédiaire d'une ou de plusieurs couches intermédiaires.
Also published as
US2006231921
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