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1. (WO2004033172) ROOM TEMPERATURE CURABLE WATER-BASED MOLD RELEASE AGENT FOR COMPOSITE MATERIALS

Pub. No.:    WO/2004/033172    International Application No.:    PCT/US2003/031289
Publication Date: Apr 22, 2004 International Filing Date: Oct 3, 2003
IPC: B28B 7/38
B29C 33/64
Applicants: HENKEL CORPORATION
LU, Zheng
SMITH, Randy, Lee
Inventors: LU, Zheng
SMITH, Randy, Lee
Title: ROOM TEMPERATURE CURABLE WATER-BASED MOLD RELEASE AGENT FOR COMPOSITE MATERIALS
Abstract:
A room temperature curable water-based mold release agent that is useful for demolding composite parts, such as epoxy and polyester based polymer materials. The mold release agent is curable at low temperatures, such as room temperature, but is thermally stable up to conventional epoxy based composite molding temperatures, e.g., greater than 200 or 280°C. The mold release agent is useful for demolding large composite parts that are cured in large ovens at high temperature when the molds themselves are prepped at room temperature before placing in the oven. The mold release agent is also useful for demolding polyester composite parts that are prepared and cured at low temperature such as room temperature.