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Pub. No.:    WO/2004/032187    International Application No.:    PCT/US2003/029689
Publication Date: 15.04.2004 International Filing Date: 19.09.2003
H01L 21/00 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; P.O. Box 450-A, Santa Clara, CA 95052 (US)
Inventors: HO, Henry; (US).
CUI, Anqing; (US).
YUAN, Xiaoxiong; (US)
Agent: BERNADICOU, Michael, A.; Blakely, Sokoloff, Taylor & Zafman, LLP 12400 Wilshire Boulevard, 7th Floor, Los Angeles, CA 90025 (US)
Priority Data:
10/246,865 19.09.2002 US
Abstract: front page image
(EN)A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element, and the second heating element is offset from the first heating element in a plane substantially parallel to at least one of the first plane and the second plane.
(FR)Cette invention se rapporte à un appareil chauffant comprenant un suscepteur constitué par une surface présentant une zone de support pour plaquettes et par un corps, une tige couplée au suscepteur, et un premier et un second élément chauffant. Le premier élément chauffant est placé dans un premier plan du corps du suscepteur. Le second élément chauffant est placé dans un second plan du corps du suscepteur à une plus grande distance de la surface du suscepteur que le premier élément chauffant, et le second élément chauffant est décalé par rapport au premier élément chauffant dans un plan essentiellement parallèle au premier plan et/ou au second plan.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)