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1. (WO2004031426) ELEMENT FOR THERMAL FUSE, THERMAL FUSE AND BATTERY INCLUDING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/031426    International Application No.:    PCT/JP2003/012769
Publication Date: 15.04.2004 International Filing Date: 06.10.2003
IPC:
H01H 37/76 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8501 (JP) (For All Designated States Except US).
SENDA, Kenji [JP/JP]; (JP) (For US Only).
MUKAI, Takahiro [JP/JP]; (JP) (For US Only).
IZAKI, Masatoshi [JP/JP]; (JP) (For US Only)
Inventors: SENDA, Kenji; (JP).
MUKAI, Takahiro; (JP).
IZAKI, Masatoshi; (JP)
Agent: IWAHASHI, Fumio; Matsushita Electric Industrial Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8501 (JP)
Priority Data:
2002-293865 07.10.2002 JP
Title (EN) ELEMENT FOR THERMAL FUSE, THERMAL FUSE AND BATTERY INCLUDING THE SAME
(FR) ELEMENT DE FUSIBLE THERMIQUE, FUSIBLE THERMIQUE ET BATTERIE COMPRENANT CELUI-CI
(JA) 温度ヒューズ用素子、温度ヒューズおよびそれを用いた電池
Abstract: front page image
(EN)A thermal fuse comprising a first insulating film fitted with a pair of metal terminals; a fusible alloy positioned above the first insulating film and connected to distal ends of the pair of metal terminals so as to lie therebetween; and a second insulating film positioned above the fusible alloy and fitted to the first insulating film so as to provide space between the first insulating film and the second insulating film. The fusible alloy consists of an Sn-Bi-In alloy comprising 20 to 39.5 wt.% of Sn, 11.5 to 31 wt.% of Bi and 49 to 68.5 wt.% of In. This fusible alloy does not contain Pb and Cd, so that leaching of Pb and Cd even after disposal thereof can be avoided.
(FR)L'invention concerne un fusible thermique comprenant un premier film isolant pourvu d'une paire de bornes métalliques; un alliage fusible positionné au-dessus du premier film isolant et connecté aux extrémités distales de la paire de bornes métalliques de manière à s'étendre entre celles-ci; et un second film isolant positionné au-dessus de l'alliage fusible et connecté au premier film isolant de manière à laisser un espace entre le premier film isolant et le second film isolant. L'alliage fusible est fait d'un alliage Sn-Bi-In comprenant de 20 à 39,5 % en poids de Sn, de 11,5 à 31 % en poids de Bi, et de 49 à 68,5 % en poids de In. L'alliage fusible ne contient ni de Pb ni de Cd, de manière à éviter la lixiviation du Pb et du Cd, y compris après leur élimination.
(JA)温度ヒューズは一対の金属端子を取り付けた第1の絶縁フィルムと、第1の絶縁フィルムの上方に位置して一対の金属端子の先端部間に接続された可溶合金と、この可溶合金の上方に位置し、かつ第1の絶縁フィルムとの間に空間を形成するように第1の絶縁フィルムに取り付けられる第2の絶縁フィルムとを備える。可溶合金はSnを20重量%以上39.5重量%以下、Biを11.5重量%以上31重量%以下、Inを49重量%以上68.5重量%以下含有するSn−Bi−In合金で構成される。この可溶合金はPbやCdを含有しないので、廃棄後でもPbやCdが溶出しない。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)