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Machine translation
1. (WO2004027873) N-P BUTTING CONNECTIONS ON SOI SUBSTRATES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/027873    International Application No.:    PCT/US2003/027790
Publication Date: 01.04.2004 International Filing Date: 05.09.2003
Chapter 2 Demand Filed:    26.01.2004    
IPC:
H01L 21/8244 (2006.01), H01L 21/84 (2006.01), H01L 27/11 (2006.01), H01L 27/12 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard, Santa Clara, CA 95052 (US)
Inventors: WEBB, M., Clair; (US).
BOHR, Mark; (US)
Agent: MALLIE, Michael, J.; Blakely, Sokoloff, Taylor & Zafman, 7th Floor, 12400 Wilshire Boulevard, Los Angeles, CA 90025 (US)
Priority Data:
10/245,933 17.09.2002 US
Title (EN) N-P BUTTING CONNECTIONS ON SOI SUBSTRATES
(FR) CONNECTEURS N-P ABOUTES SUR DES SUBSTRATS SOI
Abstract: front page image
(EN)An SOI connection for connecting source/drain regions of one transistor to source/drain regions of another transistor without the use of overlying metal. The regions abut, and a salicide interconnects the regions.
(FR)L'invention concerne une connexion SOI permettant de connecter les zones source/drain d'un transistor aux zones source/drain d'un autre transistor sans utiliser de métal de revêtement. Les zones sont aboutées, et un salicyde interconnecte les zones.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)