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Machine translation
1. (WO2004027114) ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/027114    International Application No.:    PCT/JP2003/006498
Publication Date: 01.04.2004 International Filing Date: 23.05.2003
IPC:
C23C 18/16 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-chome, Minato-ku, Tokyo 107-8481 (JP) (For All Designated States Except US).
MARUMO, Yoshinori [JP/JP]; (JP) (For US Only).
JOMEN, Miho [JP/JP]; (JP) (For US Only).
KOMIYA, Takayuki [JP/JP]; (JP) (For US Only).
SATO, Hiroshi [JP/JP]; (JP) (For US Only).
CHUNG, Gishi [KR/JP]; (JP) (For US Only)
Inventors: MARUMO, Yoshinori; (JP).
JOMEN, Miho; (JP).
KOMIYA, Takayuki; (JP).
SATO, Hiroshi; (JP).
CHUNG, Gishi; (JP)
Agent: SUYAMA, Saichi; Kanda Higashiyama Bldg., 1, Kandata-cho 2-chome, Chiyoda-ku, Tokyo 101-0046 (JP)
Priority Data:
2002-273668 19.09.2002 JP
Title (EN) ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD
(FR) APPAREIL ET PROCEDE DE DEPOT AUTOCATALYTIQUE
(JA) 無電解メッキ装置、および無電解メッキ方法
Abstract: front page image
(EN)A plate is placed near a substrate held by a substrate holding section. A treating liquid is ejected from a treating liquid ejecting section, thereby plating the substrate electrolessly. The treating liquid flows through the gap between the substrate and the plate. Therefore a flow of the treating liquid occurs on the substrate. As a result, a fresh treating liquid can be supplied onto the substrate. Thus, a plating film can be formed very uniformly on the substrate even if the amount of treating liquid is small.
(FR)Une plaque est disposée à proximité d'un substrat supporté par une section de support de substrat. Un liquide de traitement est éjecté d'une section d'éjection de liquide de traitement, ce qui permet d'effectuer un dépôt autocatalytique sur ledit substrat. Le liquide de traitement s'écoule dans un espace situé entre le substrat et la plaque, un écoulement de liquide de traitement étant déposé sur ledit substrat. De ce fait, un liquide de traitement frais peut être déposé sur le substrat. En conséquence, il est possible de former un film de dépôt autocatalytique très uniforme sur le substrat même lorsque la quantité de liquide est petite.
(JA) 基板保持部に保持された基板とプレートとの間隔を近接させ、処理液吐出部から処理液を吐出することで、基板に無電解メッキを施す。処理液が基板とプレート間のギャップを流れることから、基板上に処理液の流れが生じ、基板上に新鮮な処理液を供給することが可能となる。この結果、処理液が少量の場合でも基板上に均一性良くメッキ膜を形成することが可能となる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)