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Machine translation
1. (WO2004026573) CORRUGATED ENGINEERING PLASTIC CARDBOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/026573    International Application No.:    PCT/JP2003/011943
Publication Date: 01.04.2004 International Filing Date: 18.09.2003
Chapter 2 Demand Filed:    01.04.2004    
IPC:
B32B 3/28 (2006.01), B60R 13/08 (2006.01), G10K 11/162 (2006.01), G10K 11/172 (2006.01)
Applicants: NAGOYA OILCHEMICAL CO., LTD. [JP/JP]; 213-5, Honowari, Minamishibata-cho, Tokai-shi, Aichi 476-0001 (JP) (For All Designated States Except US).
OGAWA, Masanori [JP/JP]; (JP) (For US Only).
ITO, Kuninori [JP/JP]; (JP) (For US Only)
Inventors: OGAWA, Masanori; (JP).
ITO, Kuninori; (JP)
Agent: USAMI, Tadao; No.102, 32, Tsukimigaoka, Yatomi-cho, Mizuho-ku, Nagoya-shi, Aichi 467-0035 (JP)
Priority Data:
2002-274914 20.09.2002 JP
2003-16077 24.01.2003 JP
Title (EN) CORRUGATED ENGINEERING PLASTIC CARDBOARD
(FR) PANNEAU ONDULE DE PLASTIQUE INDUSTRIEL
(JA) エンジニアリングプラスチックダンボール
Abstract: front page image
(EN)A corrugated engineering plastic cardboard (1) having a core material (2) and a covering material (3) attached to one side or both sides of said core material (2), wherein at least the core material (2) is made of an engineering plastic such as polyphenylene ether or a polymer alloy of said engineering plastic with a thermoplastic resin such as polypropylene. The corrugated engineering plastic cardboard is excellent in the resistance to heat.
(FR)L'invention porte sur un panneau ondulé (1) de plastique industriel comportant une âme (2) et un matériau de revêtement (3) fixé à un ou côtés de l'âme (2). Le matériau de l'âme est un plastique industriel tel que de l'éther de polyphénylène ou un alliage de polymères comprenant ledit plastique industriel et une résine thermoplastique telle que le polypropylène. Ledit panneau présente une excellente résistance à la chaleur.
(JA)本発明の課題は、耐熱性に優れるエンジニアリングプラスチックダンボールを提供することにある。芯材(2)と、該芯材(2)の片面または両面に被着される被覆材(3)とからなるダンボール(1)であって、少なくとも芯材(2)を、ポリフェニレンエーテル等のエンジニアリングプラスチックまたは該エンジニアリングプラスチックとポリプロピレン等の熱可塑性樹脂とのポリマーアロイを材料とするエンジニアリングプラスチック(1)を提供する。
Designated States: AU, CA, CN, KR, US.
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)