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1. WO2004023857 - HEAT SPREADER WITH SURFACE CAVITY

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Publication Number WO/2004/023857
Publication Date 18.03.2004
International Application No. PCT/US2003/025474
International Filing Date 13.08.2003
Chapter 2 Demand Filed 02.04.2004
IPC
H01L 23/42 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/433 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433Auxiliary members characterised by their shape, e.g. pistons
CPC
H01L 23/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
H01L 23/433
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • SUN MICROSYSTEMS, INC. [US]/[US]
Inventors
  • GEKTIN, Vadim
  • MALLADI, Deviprasad
  • KEARNS, Donald, A.
Agents
  • KIVLIN, B., Noël
  • DAVIES, Simon, Robert
Priority Data
10/233,85803.09.2002US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HEAT SPREADER WITH SURFACE CAVITY
(FR) DISSIPATEUR THERMIQUE DOTE D'UNE CAVITE SUPERFICIELLE
front page image
Abstract
(EN)
A heat spreader for cooling an electronic component. The heat spreader includes a thermal interface material disposed in a cavity in the body of the heat spreader. The thermal interface material is at least partially enclosed in the cavity by a surface of the electronic component or a heat sink.
(FR)
La présente invention se rapporte à un dissipateur thermique conçu pour refroidir un composant électronique. Ce dissipateur thermique comprend une matière d'interface thermique disposée dans une cavité ménagée dans son corps. La matière d'interface thermique est au moins partiellement enfermée dans la cavité par une surface du composant électronique ou un puits thermique.
Also published as
US20040042178
AU2003258235
Latest bibliographic data on file with the International Bureau
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