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1. WO2004022663 - CONDUCTIVE ADHESIVE AND CIRCUIT COMPRISING IT

Publication Number WO/2004/022663
Publication Date 18.03.2004
International Application No. PCT/JP2002/008969
International Filing Date 04.09.2002
Chapter 2 Demand Filed 26.12.2002
IPC
C09J 9/02 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
H01B 1/22 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 3/32 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
CPC
C08K 3/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
C09J 2301/408
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
408additives as essential feature of the adhesive layer
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 2201/0218
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0218Composite particles, i.e. first metal coated with second metal
H05K 2201/0272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0263Details about a collection of particles
0272Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
Applicants
  • NAMICS CORPORATION [JP]/[JP] (AllExceptUS)
  • KOMAGATA, Michinori [JP]/[JP] (UsOnly)
  • SHIRAI, Yukio [JP]/[JP] (UsOnly)
  • SUZUKI, Kenichi [JP]/[JP] (UsOnly)
  • SUGANUMA, Katsuaki [JP]/[JP]
Inventors
  • KOMAGATA, Michinori
  • SHIRAI, Yukio
  • SUZUKI, Kenichi
  • SUGANUMA, Katsuaki
Agents
  • TSUKUNI, Hajime
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONDUCTIVE ADHESIVE AND CIRCUIT COMPRISING IT
(FR) ADHESIF CONDUCTEUR ET CIRCUIT L'UTILISANT
(JA) 導電性接着剤およびそれを用いた回路
Abstract
(EN)
A conductive adhesive containing conductive particles and resin, and a circuit bonded with this adhesive. This conductive adhesive is characterized in that 30wt% or more of the conductive particles consists substantially of silver and tin, and in that the molar ratio between silver and tin that are the metal components of the conductive adhesive is in the range of 77. 5:22.5 to 0:100.
(FR)
L'invention porte sur un adhésif conducteur comprenant des particules conductrices et une résine, et sur un circuit collé au moyen dudit adhésif caractérisé en ce que 30 % en poids desdites particules sont substantiellement d'argent et d'étain, et en ce que le rapport molaire entre les composés métalliques de l'adhésif est compris entre 77,5/22,5 et 0/100.
(JA)
not available
Latest bibliographic data on file with the International Bureau