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1. WO2004010176 - DIRECT DEPOSITION WAVEGUIDE MIRROR

Publication Number WO/2004/010176
Publication Date 29.01.2004
International Application No. PCT/US2003/018541
International Filing Date 11.06.2003
Chapter 2 Demand Filed 03.11.2003
IPC
G02B 6/12 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
G02B 6/122 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
G02B 6/125 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
125Bends, branchings or intersections
G02B 6/43 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
CPC
G02B 2006/121
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
12083Constructional arrangements
121Channel; buried or the like
G02B 6/12002
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
12002Three-dimensional structures
G02B 6/122
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
G02B 6/125
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
125Bends, branchings or intersections
G02B 6/43
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Applicants
  • HONEYWELL INTERNATIONAL INC. [US]/[US] (AllExceptUS)
  • DOI, Yutaka [US]/[US] (UsOnly)
Inventors
  • DOI, Yutaka
Agents
  • THOMPSON, Sandra P.
Priority Data
10/198,81618.07.2002US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DIRECT DEPOSITION WAVEGUIDE MIRROR
(FR) MIROIR DE GUIDE D'ONDES A DEPOT DIRECT
Abstract
(EN)
Waveguides (100) formed via direct deposition of reflective material on isolated surfaces (113, 114) of the waveguides rather than every surface of the waveguides are described. Direct deposition facilitates deposition on isolated surfaces, which in turn reduces costs and risks. Cost is reduced by reducing the amount of reflective material required. The risk of metal particles plugging the waveguide is reduced by both the decrease in amount of reflective material used, and the method of depositing it.
(FR)
L'invention concerne des guides d'ondes (100) formés par dépôt direct de matériau réfléchissant sur des surfaces isolées (113, 114) de ces guides d'ondes plutôt que sur chaque surface de ces derniers. Le dépôt direct facilite le dépôt sur des surfaces isolées qui, à son tour, réduit les coûts et les risques. Les coûts sont réduits par une réduction de la quantité de matériau réfléchissant requise. Les risques que des particules métalliques obturent le guide d'ondes sont réduits à la fois par une quantité de matériau réfléchissant utilisée réduite et par le procédé de dépôt dudit matériau.
Also published as
Latest bibliographic data on file with the International Bureau