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Machine translation
1. (WO2004009865) FABRICATION OF B/C/N/O/Si DOPED SPUTTERING TARGETS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/009865    International Application No.:    PCT/US2003/020725
Publication Date: 29.01.2004 International Filing Date: 02.07.2003
Chapter 2 Demand Filed:    29.01.2004    
IPC:
C23C 14/34 (2006.01)
Applicants: HERAEUS, INC. [US/US]; 301 North Roosevelt Avenue, Chandler, AZ 85226 (US)
Inventors: ZHANG, Wenjun; (US)
Agent: PRICE, Robert, L.; McDermott, Will & Emery, 600 13th Street, N.W., Washington, DC 20005-3096 (US)
Priority Data:
10/200,590 23.07.2002 US
Title (EN) FABRICATION OF B/C/N/O/Si DOPED SPUTTERING TARGETS
(FR) FABRICATION DE CIBLES DE PULVERISATION A DOPAGE B/C/N/O/SI
Abstract: front page image
(EN)The present invention relates to a method of manufacturing sputtering targets doped with non-metal components including boron, carbon, nitrogen, oxygen and silicon. A powder process is utilized whereby alloyed powders, which contain non-metal elements of B/C/N/O/Si and non-metal containing phases of less than the microns in microstructure, are blended, canned and subjected to hot isostatic press consolidation. The sputtering targets of the present invention avoid spitting problems during sputtering of the target material on a substrate.
(FR)L'invention concerne un procédé permettant de fabriquer des cibles de pulvérisation dopées avec des composants non métalliques comprenant le bore, le carbone, l'azote, l'oxygène et le silicium. Ce procédé consiste à appliquer un processus de traitement de poudres, consistant à mélanger, à encapsuler des poudres d'alliage contenant des éléments non métalliques de B/C/N/O/Si et des phases exemptes de métaux présentant une microstructure de moins de dix microns, puis à les traiter dans une presse isostatique à chaud (PIC) pour les solidifier. Ces cibles de pulvérisation permettent d'éviter les problèmes de projection pendant la pulvérisation du matériau cible sur un substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)