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Machine translation
1. (WO2004009719) POLISHING COMPOSITION CONTAINING CONDUCTING POLYMER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/009719    International Application No.:    PCT/IB2003/002880
Publication Date: 29.01.2004 International Filing Date: 25.06.2003
Chapter 2 Demand Filed:    13.02.2004    
IPC:
H01L 21/321 (2006.01), H01L 21/3213 (2006.01)
Applicants: CABOT MICROELECTRONICS CORPORATION [US/US]; 870 North Commons Drive, Aurora, IL 60504 (US)
Inventors: CHERIAN, Isaac, K.; (US).
ZHANG, Jiang; (US).
SUN, Fred, F.; (US).
WANG, Shumin; (US).
KLINGENBERG, Eric, H.; (US)
Agent: TURNER-BRIM, Phyllis, T.; Law Department, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, IL 60504 (US)
Priority Data:
10/199,704 19.07.2002 US
Title (EN) POLISHING COMPOSITION CONTAINING CONDUCTING POLYMER
(FR) COMPOSITION DE POLISSAGE CONTENANT UN POLYMERE CONDUCTEUR
Abstract: front page image
(EN)The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10-10 S/cm to 10-6 S/cm, and (c) a liquid carrier.
(FR)L'invention concerne un système de polissage comprenant (a) un abrasif, un tampon de polissage, un dispositif qui sert à oxyder un substrat ou une combinaison associée, (b) un polymère conducteur qui possède une conductivité électrique comprise entre 10-10 S/cm et 106 S/cm, et (c) un support liquide.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)