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Machine translation
1. (WO2004009718) METHOD OF POLISHING A SUBSTRATE WITH A POLISHING SYSTEM CONTAINING CONDUCTING POLYMER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/009718    International Application No.:    PCT/IB2003/002704
Publication Date: 29.01.2004 International Filing Date: 19.06.2003
Chapter 2 Demand Filed:    13.02.2004    
IPC:
C09K 3/14 (2006.01), H01L 21/321 (2006.01)
Applicants: CABOT MICROELECTRONICS CORPORATION [US/US]; 870 North Commons Drive, Aurora, IL 60504 (US)
Inventors: ZHANG, Jiang; (US).
SUN, Fred, F.; (US).
WANG, Shumin; (US).
CHERIAN, Isaac, K.; (US).
KLINGENBERG, Eric, H.; (US)
Agent: TURNER-BRIM, Phyllis, T.; Law Department, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US)
Priority Data:
10/198,841 19.07.2002 US
Title (EN) METHOD OF POLISHING A SUBSTRATE WITH A POLISHING SYSTEM CONTAINING CONDUCTING POLYMER
(FR) PROCEDE DE POLISSAGE D'UN SUBSTRAT AVEC UN SYSTEME DE POLISSAGE CONTENANT UN POLYMERE CONDUCTEUR
Abstract: front page image
(EN)The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10-10 S/cm to 106 S/cm, and (c) a liquid carrier, and (ï) abrading or removing at least a portion of the substrate to polish the substrate.
(FR)La présente invention concerne un procédé de polissage d'un substrat qui consiste (i) à mettre ce substrat en contact avec un système de polissage comprenant (a) un abrasif, un tampon de polissage, un organe d'oxydation de substrat ou une combinaison quelconque de ces éléments, (b) un polymère conducteur possédant une conductivité électrique de 10~'° Slcm à 106 Slcm et, (c) un porteur de liquide, (ii) et à abraser ou à retirer au moins une partie de ce substrat de façon à polir ce substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)